Wafer direct bonding of compound semiconductors and silicon at room temperature by the surface activated bonding method

• CHUNG T. R.

収録刊行物

• Appl. Surf. Sci.

  Appl. Surf. Sci. 117 (2), 808-812, 1997

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• CRID: 1571135650806919424
• NII論文ID: 80009752930
• データソース種別:
  • CiNii Articles