Microwave nondestructive detection of delamination in IC packages utilizing open-ended coaxial line sensor

• Y. Ju

• M. Saka

• H. Abé

Journal

• NDT & E International

  NDT & E International 32 (5), 259-264, 1999-07

  Elsevier BV

Keywords

• Mechanical Engineering
• Condensed Matter Physics
• General Materials Science

Details

• CRID: 1361418521312108160
• NII Article ID: 80011037382
• NII Book ID: AA10816574
• DOI: 10.1016/s0963-8695(98)00055-3
• ISSN: 09638695
• Web Site: https://api.elsevier.com/content/article/PII:S0963869598000553?httpAccept=text/xml
• Web Site: https://api.elsevier.com/content/article/PII:S0963869598000553?httpAccept=text/plain
• Data Source:
  • Crossref
  • CiNii Articles