High Thermal Conductive Epoxy Resins Containing Controlled High Order Structures
収録刊行物
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- J. Appl. Polym. Sci.
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J. Appl. Polym. Sci. 89 (9), 2464-2467, 2003
J. Appl. Polym. Sci. 89 (9), 2464-2467, 2003