Multilayer ceramic substrate-technology for VLSI package/multichip module
著者
書誌事項
Multilayer ceramic substrate-technology for VLSI package/multichip module
（Ceramic research and development in Japan）
Elsevier Applied Science, c1993
English language ed
- タイトル別名
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Seramikku tasō haisen kiban
- 統一タイトル
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Seramikku tasō haisen kiban
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注記
Translation of: Seramikku tasō haisen kiban
Includes bibliographical references (p. 223-231) and index
内容説明・目次
内容説明
This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.
目次
Introduction. Introduction. Past and current studies. Modelling of fine powder mixing and measurement of the degree of mixing. Object of this study. Study of mixing models. Simulation of the flowpath in the doctor-blade and its application to raising the precision of green sheet thickness. Object of the study. Experimental procedure. Improving dimensional precision by firing in a reducing atmosphere. Purpose of the studies. Experimental methods. Effect of forming and firing conditions on the dimensions of ceramics. Object of the study. Experimental method. Improving the strength of tungsten metallization on alumina ceramics. Purpose of the studies. Experimental methods. Electrical insulation between fine metallization on alumina ceramics, and its protection. Purpose of the study. Experimental methods. Summary. Guidelines obtained by production process. Overall summary. References. Index.
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