Joining processes : an introduction

著者

書誌事項

Joining processes : an introduction

David Brandon and Wayne D. Kaplan

Wiley, c1997

  • : hbk
  • : pbk

大学図書館所蔵 件 / 全5件

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注記

Includes bibliographical references and index

内容説明・目次

巻冊次

: hbk ISBN 9780471964872

内容説明

Joining processes are a fundamental requirement in the engineering sector. The continuing integration of polymer technology, ceramic science and metallurgy into materials science has created the need for this new text Designed for materials science and engineering students, this text provides an integrated treatment of methods of component assembly and joining processes. Mechanical, chemical and physical methods are covered, together with introductory treatments of surface science and the mechanics of joints. The book includes working examples, chapter summaries, colour diagrams and equations for highlighting key concepts.

目次

  • Surface science
  • the mechanics of joining
  • mechanical bonding
  • welding
  • weld metallurgy
  • soldering and brazing
  • metal-ceramic joints and diffusion bonding
  • adhesives
  • vacuum seals
  • microelectronic packaging.
巻冊次

: pbk ISBN 9780471964889

内容説明

This is an introductory text for students of materials science and engineering interested in the scientific background to the joining and assembly of components in engineering systems. The principles of joining and the common methods employed to achieve a reliable joint are covered in chapters that all conclude with a summary of the points covered, and a set of problems for individual study, or class discussion. In the first chapters, thorough introductory overviews are given of firstly, the mechanical, chemical and physical phenomena related to surfaces, contacts and joins. In subsequent chapters, any necessary metallurgical or chemical background is adequately covered to enable students to understand the basic principles of a variety of joining methods, microelectronic devices and vacuum assemblies. Contents: Introduction; Surface Science; The Mechanics of Joining; Mechanical Bonding; Welding; Weld Metallurgy; Soldering and Brazing; Metal-ceramic Joints and Diffusion Bonding; Adhesives; Vacuum Seals; Micro-electronic Packaging.

目次

PRINCIPLES OF JOINING. Surface Science. The Mechanics of Joining. JOINING METHODS. Mechanical Bonding. Welding. Weld Metallurgy. Soldering and Brazing. Metal-Ceramic Joints and Diffusion Bonding. Adhesives. APPLICATIONS OF JOINING. Vacuum Seals. Microelectronic Packaging. Index.

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