Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 6-8, 2000

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書誌事項

Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 6-8, 2000

co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong ... [et al.] ; technical chairs, Philip Garrou, James E. Morris

IMAPS , IEEE, [2000]

  • :softbound

タイトル別名

Advanced packaging materials

proceedings International Symposium and Exhibition on Advanced Packaging Materials : processes, properities and interfaces

00TH8507

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注記

"Refer to IEEE Catalog Number 00TH8507"--T.p. verso

Includes bibliographic references and index

内容説明・目次

内容説明

These conference proceedings cover such topics as: high density packaging materials; automotive electronics; system level packaging; chip scale packaging; optoelectronics; power packaging; sensors; actuators, and MEMS; flex circuits; and thermal management.

目次

  • High Density Packaging Materials
  • Automotive Electronics
  • System Level Packaging
  • Chip Scale Packaging
  • Optoelectronics
  • Power Packaging
  • Sensors, Actuators, and MEMS
  • Flat Panel Displays
  • Surface Mount
  • Flip Chip
  • Thick & Thin Film
  • PWB
  • Integrated Passives
  • Flex Circuits
  • Microwave
  • Thermal Management
  • Interconnection

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