Advances in electronic packaging 2003 : presented at 2003 International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii

著者

• International Electronic Packaging Technical Conference and Exhibition
• American Society of Mechanical Engineers. Electronic and Photonic Packaging Division

書誌事項

Advances in electronic packaging 2003 : presented at 2003 International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii

sponsored by the Electronic and Photonic Packaging Division, ASME

American Society of Mechanical Engineers, c2003

• : set
• 1
• 2

注記

Includes bibliographical references and index

詳細情報

• NII書誌ID(NCID): BA71987003
• ISBN:
  • 0791836908
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York, N.Y
• ページ数/冊数: 2 v.
• 大きさ: 28 cm