Design, test, integration and packaging of MEMS/MOEMS 2003 : DTIP 2003 : 5-7 May, 2003, Cannes, France

著者

• Bergman, Keren
• Centre national de la recherche scientifique (France)
• Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

書誌事項

Design, test, integration and packaging of MEMS/MOEMS 2003 : DTIP 2003 : 5-7 May, 2003, Cannes, France

Keren Bergman ... [et al.] chairs/editors ; sponsored by CNRS-INPG-UJF ... [et al.]

IEEE, c2003

タイトル別名

DTIP 2003

注記

"IEEE Catalog Number 03EX713"--T.p. verso

"2003 proceedings, Fifth Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS"--T.p. verso

Includes bibliographical references and partial author index

詳細情報

• NII書誌ID(NCID): BA77386243
• ISBN:
  • 078037066X
• LCCN: 2004299331
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: Piscataway, N.J.
• ページ数/冊数: xi, 411 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7874
  • DC22 : 621.381
• 件名:
  • LCSH : Microelectromechanical systems -- Congresses
  • LCSH : Optoelectronic devices -- Congresses
  • LCSH : Micromachining -- Congresses
  • LCSH : Microelectronic packaging -- Congresses