Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2011 : symposium held April 25-29, 2011, San Francisco, California, U.S.A.
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書誌事項
Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2011 : symposium held April 25-29, 2011, San Francisco, California, U.S.A.
（Materials Research Society symposium proceedings, v. 1335）
Materials Research Society , Cambridge University Press, 2012
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注記
"Symposium O, 'Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics', held at the April 25-29, 2011 MRS Spring Meeting in San Francisco, California"--P. ix
Includes bibliographical references and indexes
内容説明・目次
内容説明
This volume includes selected papers based on the presentations given at Symposium O, 'Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics', held at the April 25 29, 2011 MRS Spring Meeting in San Francisco, California. The symposium included topics relating to low-k dielectrics, integration, reliability, metallization, packaging and emerging technologies.
目次
- Part I. Low-k Materials: 1. Ultra low-k materials based on self-assembled organic polymers Marianna Pantouvaki
- 2. New designs of hydrophobic and mesostructured ultra low k materials with isolated mesopores Anthony Grunenwald
- 3. Evaluation of ultra-thin layer fabricated by wet-process as a pore-seal for porous low-k films Shoko Ono
- 4. Ozone treatment on nanoporous ultralow dielectric materials to optimize their mechanical and dielectrical properties Hee-Woo Rhee
- Part II. Integration: 5. Optimizing stressor film deposition sequence in polish rate order for best planarization John H. Zhang
- 6. Effect of chemical solutions and surface wettability on the stability of advanced porous low-k materials Quoc Toan Le
- 7. A less damaging patterning regime for a successful integration of ultra low-k materials in modern nanoelectronic devices Sven Zimmermann
- 8. Defects in low-q insulators (q=2.5-2.0): ESR analysis and charge injection Valeri Afanas'ev
- 9. Patterning organic fluorescent molecules with SAM patterns Nan Lu
- 10. Optical interconnect technologies based on silicon photonics Wim Bogaerts
- Part III. Metallization: 11. 32nm node highly reliable Cu/low-k integration technology with CuMn alloy seed Shaoning Yao
- 12. Amorphous Ta-N as a diffusion barrier for Cu metallization Neda Dalili
- 13. Comparison of TiN thin films grown on SiO2 by reactive dc magnetron sputtering and high power impulse magnetron sputtering Jon Gudmundsson
- 14. Specific contact resistance of ohmic contacts on n-type SiC membranes Patrick Leech
- 15. Development of electrochemical copper deposition screening methodologies for next generation additive selection Kevin Ryan
- Part IV. 3D Packaging: 16. Microbump impact on reliability and performance in through-silicon via stacks Aditya Karmarkar
- 17. Tailoring the crystallographic texture and electrical properties of inkjet-printed interconnects for use in microelectronics Romain Cauchois.
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