Surface preparation techniques for adhesive bonding

著者

    • Wegman, Raymond F.
    • Twisk, James van

書誌事項

Surface preparation techniques for adhesive bonding

by Raymond F. Wegman and James Van Twisk

Elsevier , William Andrew, c2013

2nd ed

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注記

Includes bibliographical references and index

内容説明・目次

内容説明

Surface Preparation Techniques for Adhesive Bonding is an essential guide for materials scientists, mechanical engineers, plastics engineers, scientists and researchers in manufacturing environments making use of adhesives technology. Wegman and van Twisk provide practical coverage of a topic that receives only cursory treatment in more general books on adhesives, making this book essential reading for adhesion specialists, plastics engineers, and a wide range of engineers and scientists working in sectors where adhesion is an important technology, e.g. automotive / aerospace, medical devices, electronics. Wegman and van Twisk provide a wealth of practical information on the processing of substrate surfaces prior to adhesive bonding. The processing of aluminum and its alloys, titanium and its alloys, steels, copper and its alloys, and magnesium are treated in the form of detailed specifications with comparative data. Other metals not requiring extensive treatment are also covered in detail, as are metal matrix and organic matrix composites, thermosets and thermoplastics. This new edition has been updated with coverage of the latest developments in the field including the sol-gel process for aluminum, titanium, and stainless steel, atmospheric plasma treatment for metals, plastics and rubbers and treatments for bronze and nickel alloys.

目次

1. Introduction 2. Aluminum and Aluminum Alloys 3. Titanium and Titanium Alloys 4. Steel and Stainless Steel 5. Copper and Copper Alloys 6. Magnesium 7. Other Metals 8. Plastics 9. Rubbers 10. Utilizing Openair (R) Plasma for Better Adhesion

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詳細情報

  • NII書誌ID(NCID)
    BB14141351
  • ISBN
    • 9781455731268
  • LCCN
    2012554019
  • 出版国コード
    ne
  • タイトル言語コード
    eng
  • 本文言語コード
    eng
  • 出版地
    Amsterdam,Oxford
  • ページ数/冊数
    xvi, 148 p.
  • 大きさ
    24 cm
  • 分類
  • 件名
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