Osawa Tadashi

ID:9000253022536

Department of Mechanical Engineering, Faculty of Science and Technology, Aoyamagakuin University (1972年 CiNii収録論文より)

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  • On the Growth of Alloy Layer between Solid Copper and Liquid Tin

    Kawakatsu Ichiro , Osawa Tadashi , Yamaguchi Hiroshi

    In our previous papers, the dissolution of solid copper into liquid tin and the influences of additional elements to liquid tin were reported as a fundamental research of soldering. The purpose of thi …

    Transactions of the Japan Institute of Metals 13(6), 436-443, 1972

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