Tomikawa Masao

ID:9000300213238

Electronic & Imaging Materials Research Laboratories, Toray Industries, Inc. (2015年 CiNii収録論文より)

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  • Photosensitive Polyimide for Packaging Applications

    Tomikawa Masao , Okuda Ryoji , Ohnishi Hiroyuki

    Recently packaging technologies progress so much for high density, low profile and small foot print. For those applications, Photo sensitive polyimide (PSPI) applied as a re-distribution layer for the …

    Journal of Photopolymer Science and Technology 28(1), 73-77, 2015

    J-STAGE

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