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COVER
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[OTHERS]
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Preface
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Comments
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CONTENTS
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[OTHERS]
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Computer Aided Proximity Effect Correction System in Photolithography : Lithography Technology
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3-6
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PLES : A Photolithography Expert System : Lithography Technology
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7-9
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Sub-Half-Micron I-Line Lithography by Use of LMR-UV Resist : Lithography Technology
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10-14
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Optical Lithography for 0.5 to 0.3 μm LSI : Lithography Technology
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15-21
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Pressure-Controlled Wavelength Stabilization of a KrF Excimer Laser with Narrowed Bandwidth : Lithography Technology
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22-24
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Design and Performance Highlights of a KrF Excimer Laser for Microlithography : Lithography Technology
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25-28
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Stabilization of Wavelength on a Light Generated by a KrF Excimer Laser : Lithography Technology
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29-32
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Present Status of an Excimer Laser Stepper : Lithography Technology
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33-36
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The Optimization of Excimer Lasers Radiation Characteristics for Projection Lithography : Lithography Technology
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37-42
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Resolution Limits of Electron Beam Lithographys : Lithography Technology
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43-46
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Multi-Beam Concepts for Nanometer Devices : Lithography Technology
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47-53
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Electron Beam Pattern Generator with Photon to Electron Image Conversion : Lithography Technology
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54-58
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Triangular Shaped Beam Technique in EB Exposure System EX-7 for ULSI Pattern Formation : Lithography Technology
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59-63
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Shape Data Operations for VSB EB Data Conversion Using CAD Tools : Lithography Technology
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64-67
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One-Layer Technique for Absorber Structuring of E-Beam Written Mastermasks for X-Ray Lithography : Lithography Technology
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68-71
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SOR Lithography : Lithography Technology
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72-75
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X-Ray Mask Technology : Lithography Technology
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76-78
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X-ray Lithograpty : Novel Fabrication Process for SiC/W steppermasks : Lithography Technology
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79-84
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Fabrication of an ultra Low Stress Tungsten Absorber for X-Ray Masks : Lithography Technology
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85-88
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A Low Sress Stable W Sputtered Absorber Technology for X-Ray Masks : Lithography Technology
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89-92
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Ta/SiN-Stucture X-Ray Masks for Sub-Half-Micron LSIs : Lithography Technology
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93-98
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Backside Helium Cooling of X-Ray Masks in Reactive Ion Etching Processes : Lithography Technology
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99-103
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Helios : A Compact Synchrotron for X-Ray Lithography : Lithography Technology
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104-107
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Status of Compact SR Light Source for X-Ray Lithography : Lithography Technology
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108-112
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X-Ray Lithography Station at Super-ACO : Lithography Technology
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113-115
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A Beamline and Its Components for SR Lithography : Lithography Technology
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116-119
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The Effects of Secondary Electrons form a Silion Substrate on SR X-Ray Lithography : Lithography Technology
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120-123
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New Evaluation Approach of Alignment Signal from Resist-Coated Patterns : Lithography Technology
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124-129
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Synchrotron Radiation Lithography for DFB Laser Gratings : Lithography Technology
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130-134
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A Method to Compensate Decay of Power in SR Lithography : Lithography Technology
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135-138
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Performance of a Gas Phase Focused Ion Beam System : Lithography Technology
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139-142
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Focused Ion Beam Lithography with Transition Metal Oxide Resists : Lithography Technology
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143-147
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[OTHERS]
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Submicron Imaging at 248.3 NM : A Lithographic Performance Review of an Advances Negative Resist Designed for low "K_1" Processing : Resist Material and Process
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151-155
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Image Reversal Characteristics of a Novel Silicone-Based Positive Photoresist (SPP) in Near UV Lithography : Resist Material and Process
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156-160
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Analysis of Chemical Amplification Resist Systems Using a Kinetic Model and Numerical Simulation : Resist Material and Process
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161-166
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Effect of the Structure of a Photoactive Compound on the Dissolution Inhibition Effect : Resist Material and Process
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167-170
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Microlithography Resists Containing Poly(1,1-dimethylsilazane) : Resist Material and Process
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171-176
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Sulfonamide-Phenolic Resin Negative Resist for KrF Excimer Laser Lithography : Resist Material and Process
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177-180
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Application of Photobleachable Positive Resist and contrast Enhancement Material to KrF Excimer Laser Lithography : Resist Material and Process
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181-185
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Dissolution Behavior of Novolak/Dissolution Inhibitor Resist Systems in an Aqueous Base Developer : Resist Material and Process
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186-191
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Characteristics of Adhesion between Photoresist and Inorganic Substrate : Resist Material and Process
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192-196
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Simulation of Three-Dimensional Positive Photoresist Images : Resist Material and Process
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197-201
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[OTHERS]
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High Flux Low Energy Reactive Ion Etching in a Magnetic Multipole Reactor : Etching and Deposition Technology
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205-208
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Wet Chemical Etching for Ultrafine Periodic Structure : Rectangular InP Corrugations of 70 nm Pitch and 100 nm Depth : Etching and Deposition Technology
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209-212
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New Taper-Etching Technology Using Oxygen Ion Plasma : Etching and Deposition Technology
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213-216
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MOS Gate Etching Using an Advanced Magnetron Etching System : Etching and Deposition Technology
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217-222
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Downstream Etching of Si and SiO_2 Employing CF_4/O_2 or NF_3/O_2 at High Temperature : Etching and Deposition Technology
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223-226
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Ashing of Ion-Implanted Resist Layer : Etching and Deposition Technology
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227-233
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Very High Selective N^+ poly-Si RIE with Carbon Elimination : Etching and Deposition Technology
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234-238
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Cold and Low-Energy Ion Etching(COLLIE) : Etching and Deposition Technology
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239-242
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Laser-Induced Etching of Mn-Zn ferrite and Its Application : Etching and Deposition Technology
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243-248
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Induced Defects in GaAs Etched by Low Energy Ions in Electron Beam excited Plasma(EBEP) System : Etching and Deposition Technology
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249-253
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Radiation Damage in SiO_2/Si Induced by VUV Photons : Etching and Deposition Technology
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254-258
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Low Temperature Deposition of Silicon Nitride by the Catalytic Chemical Vapor Deposition Method : Etching and Deposition Technology
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259-263
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[OTHERS]
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Laser Induced Thermal Desorption Studies of Reaction Kinetics on Si(111) 7×7 : Beam Induced Physics and Chemistry
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267-269
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Ge Atomic Layer Epitaxy by Use of Ar Ion Laser Heating : Beam Induced Physics and Chemistry
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270-273
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Incidence Angle Dependence in Hydrogen Plasma Processing of Semiconductor Surfaces : Beam Induced Physics and Chemistry
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274-276
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Removal of a Thin SiO_2 Layer by Low-Energy Hydrogen Ion Bombardment at Elevated Temperatures : Beam Induced Physics and Chemistry
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277-282
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Growth Kinetics of Silicon Thin Film Studied by Hydrogen Radical and Ion Irradiation : Beam Induced Physics and Chemistry
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283-287
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Wafer Cleaning with Photoexcited Chlorine and Thermal Treatment for High-Quality silicon Epitaxy : Beam Induced Physics and Chemistry
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288-292
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Focused Ion Beam Technology : Beam Induced Physics and Chemistry
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293-297
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Fluorine Gas Field Ion Source : Beam Induced Physics and Chemistry
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298-302
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Silicon Oxide Film Formation by Focused Ion Beam (FIB)-Assisted Deposition : Beam Induced Physics and Chemistry
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303-306
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Simulation of X-Ray Mask Repair by Means of FIB-Technology : Beam Induced Physics and Chemistry
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307-312
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Optimization of Deposition Parameters for E-Beam Induced X-Ray Mask Repair : Beam Induced Physics and Chemistry
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313-315
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Shallow Doping of Boron into Silicon by Excimer Laser Irradiation : Beam Induced Physics and Chemistry
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316-319
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Direct Formation of Three-Dimensional Structures in GaAs by Excimer Laser Doping : Beam Induced Physics and Chemistry
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320-324
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SOI Formation Using Lateral Solid-Phase Epitaxy Induced by Focused Ion Beam : Beam Induced Physics and Chemistry
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325-329
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Performance of a Focused-Ion-Beam Implanter with Tilt-Writing Function : Beam Induced Physics and Chemistry
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330-333
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[OTHERS]
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100 nm Electron Beam Lithography for GaAs Fet Devices : Microfabrication and Physics
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337-339
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Fabrication of Ballistic Quantum Wires and Their Transport Properties : Microfabrication and Physics
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340-344
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Fabrication and Operation of Si-Coupled Superconducting FET with 0.1μm Gate : Microfabrication and Physics
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345-349
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Fabrication of Deep Sub-μm Narrow-Channel Si-MOSFET's with Twofold-Gate Structures : Microfabrication and Physics
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350-354
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Isochronous Detector for Real-Time Electron Beam Testing : Inspection and Testing
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357-359
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Improvement of a Critical Dimension Automatic Measurement Method Using S.E.M : Inspection and Testing
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360-363
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A Novel Method for Measurement of Linewidth Using Image Processing : Inspection and Testing
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364-370
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Particle Detection for Patterned Wafers Using Hybrid Optical-Digital Image Processing : Inspection and Testing
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371-376
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Linewidth Measurement by a New Scanning Tunneling Microscope : Inspection and Testing
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377-379
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A Transit-Time Dispersive Multi-Channel Voltage Contrast Detector : Inspection and Testing
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380-385
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AUTHOR INDEX
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