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表紙
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講演分野(中扉)
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大会委員会
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実行委員会
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目次
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A1-A4
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601 The epileptic discharge suppression device of the type with the heat pipe that it is possible to cool out of the body : Examination of the basic performance
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1-2
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602 Development of catheter simulator for training of intravascular surgery
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3-4
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604 Development of Appliances for Open Heart Operation
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5-6
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605 Development of vacuum extracting type HMS device
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7-8
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606 Development of automatic blood vessel searching device for HMS
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9-10
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607 換気チューブを利用した鼓膜加振デバイスの試作と評価(J04-2 診断とケア,J04 ライフサポート)
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11-12
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608 Modeling of Spasticity using Independent Component Analysis
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13-14
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609 Development of the Biped Walking Pet Robot with Short Legs
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15-16
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610 A design and implementation of alimentary therapy support system to prevent lifestyle diseases
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17-18
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611 Development of Level Holding Seat for Electric-Powered Wheelchair
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19-20
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612 Power Assist Mechanism without Running Resistance for One Hand Drive Wheelchair
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21-22
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613 Development of a Wearable Sensor System for Gait Analysis
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23-24
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614 Development of New Water Insoles
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25-26
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615 The application of walking assist device for town mobility utilities
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27-28
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616 Development of auto stretching device for lower limbs
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29-30
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617 Development of Fitness Apparatus for Wheelchair User
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31-32
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618 Development of Air Control Bed Supporting Human Body by Multi-Planes
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33-34
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619 Mechanical Approach for the Artificial Muscle Spindle Development
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35-36
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620 Measurement of working posture in manufacturing cell using digital-video network
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37-38
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748 Interaction between two swimming micro-organisms
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39-40
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750 Trabecular bone remodeling simulation considering interstitial fluid flow
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41-42
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751 Mechanical Modeling of High Speed Filtration with Electric Charge Effect in Renal Glomerulus and Their Capillaries
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43-44
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752 Effect of RBC Deformations on blood current in a capillary
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45-46
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753 A Multi-scale Computational Study about Left Ventricle form and performance
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47-48
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754 Creep-Relaxation Remodeling Analysis of Coronary Atheroscherotic Artery, Subjected to PTCA Balloon Pumping Pressure, Coupled with STENT-LEFT Effect
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49-50
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755 Development of an Arterial-Venous, Multi-Scale Computational Mechanical Model
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51-52
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756 Modeling of Outflow Boundary Conditions Based on Peripheral Vessel Network for Hemodynamic Simulation
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53-54
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757 Computational Analysis of Wall Thickness at a Three-dimensional Bifurcation Based on the Uniform Strain Hypothesis
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55-56
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2027 Molecular dynamics simulation of interaction of copper precipitates and screw dislocation in iron
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57-58
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2028 Evaluation of Crack Initiation Driving Force for Irradiation Assisted Stress Corrosion Cracking by Three-Dimensional Polycrystalline Model
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59-60
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2029 Molecular Dynamics Analysis on Crack Growth Behavior in Nano-crystalline Fe by the Use of FS-MEAM Hybrid Potential
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61-62
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2030 Evaluation of Viscoelastic Deformation Behavior of Carbon-Black-Filled Rubber under Monotonic and Cyclic Loading
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63-64
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2032 The study of fracture process from ductile fracture to shear-lip fracture
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65-66
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2033 Evaluation of Fractal Dimensions of Fracture Surfaces Using Box-Counting Method
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67-68
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2034 Influence of Free Boundaries on the Behaviour of Wing Crack Growth
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69-70
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2035 Estimation of Stress Intensity Factor for Stably-growing Cracks in a Thermal Stress Cleaving
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71-72
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2036 Otpimal Design of Hydrogen Storage Pressure Housing for Underwater Vehicles
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73-74
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2037 Countermeasure by Metal Coating against FRP Blade Lightning Failure for Wind Turbine Generators
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75-76
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2038 Application of Mesh Superposition method to Fatigue strength evaluation of welded joint
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77-78
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2039 A new approach to large scale fracture mechanics analysis : use of tetrahedral finite elements
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79-80
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2040 Development of Pre- and Post-processors for 3-D Complicated Crack Geometry
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81-82
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2041 Three-Dimensional Crack Analysis using Virtual Crack Closure-integral Method (VCCM) for Quadratic Tetrahedral Finite Element
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83-84
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2101 Identification of Distribution of Elastic Constants by Meshless Finite Element-Filter Theory
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85-86
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2102 Damage Identification Analysis of Frame Structures Using Variable Projection Filter
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87-88
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2103 A Study on an Application of the Passive Electric Potential CT Method for Identification of Two Delaminations in a Composite Material
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89-90
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2104 Criterion for Self-identification of Adaptive Structure Systems with Variable Structural Parameters
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91-92
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2105 SHAPE OPTIMIZATION OF NOISE BARRIER USING BEM AND GA
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93-94
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2106 Simplification of Inverse Analysis of Heat Conduction for Thermoelastic Stress Analysis
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95-96
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2107 Detection of Defects by Means of BEM Based on DRM Using Thermal Measurement Data
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97-98
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2108 Inverse Analysis Method of Welding Eigen-strain and Estimation of their Influence Factors for Design by Analysis (3rd Report)
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99-100
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2109 Inverse Analysis in Bending Problems of a Beam
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101-102
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2110 An inverse method for determining the optimum fluid temperature history to reduce transient thermal stress in a thin-walled pipe in shutdown
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103-104
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2111 Optimization of the shape of plating bath to planarize thickness of the distribution in semiconductor plating
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105-106
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2112 Regularization of Ill-posed Optical Computed Tomography Using Optical Absorption with Binary Constraints
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107-108
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2113 A nano-resolution method for magnetic-field reconstruction using a thin-film magnetic sensor
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109-110
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3201 An Optimal Design of Partially Rigidizable Inflatable Structures
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111-112
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3202 Adaptive Control of Smart Structural Systems with Characteristic Variation
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113-114
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3203 Fault Detection for Smart Structures by using Recurrent Neural Networks
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115-116
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3204 Selection of Optimal Standard Response Surface for Unsupervised Statistical Damage Diagnostic Method
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117-118
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3205 Study on Semiconductor Strain Sensor Sensitivity
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119-120
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3206 Strain Monitoring of Rotating Axis using Semiconductor Strain Sensor Chip
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121-122
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3207 Semiconductor Strain Sensor for Measuring Biaxial Strain Field
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123-124
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3208 Measurements of Stress Distributions by Long Gauge FBG Sensor
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125-126
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3209 Generation Laser Scanning Method for the Visualization of Ultrasounds and Its Applicability to Nondestructive Inspection
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127-128
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3210 Theoretical investigation on distributed measurements with FBG sensor by using optical frequency domain reflectometry
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129-130
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3211 VaRTM Process Monitoring and Health Monitoring with Distributed Measurements by FBG Sensors
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131-132
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3212 Cure Evaluation of Chain Curing Polymers Using Embedded Optical Fibers
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133-134
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3213 Application of statistical damage detection into CFRP structure using multiple electrical resistance changes
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135-136
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3214 Damage Detection of CFRP Laminate by Using Electrical Resistance Change under Cyclic Load
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137-138
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3215 Guided Wave Diagnosis in Advanced Grid Structure
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139-140
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3216 Smart sandwich panels with impact damage detection and shape recovery functions
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141-142
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3217 Evaluation of Fatigue Crack of the Steel Structure via the Unsupervised Statistical Damage Diagnostic Method using FBG sensors
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143-144
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3218 Trials to Realize the Active Material Systems
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145-146
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3219 Secondary Shape Forming in Polyurethane-Shape Memory Polymer
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147-148
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3220 Development of hinge less structure by using partially flexible CFRP
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149-150
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3221 Fabrication of metallic closed cellular materials containing ceramics
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151-152
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3222 Direct Observation of Crack-Healing Behavior of Structural Ceramics under Stress
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153-154
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3223 Control of a Robot Gripper by using Self-Sensing Actuation
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155-156
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3224 Development of the Computer Assisted Surgery System using Curved Multi-Tube System
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157-158
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3225 Design of Piezo-actuated Micro-Catheter for Dissolution of Thrombus
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159-160
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3226 Friction wear property of partly polished CVD diamond with surface microstructure
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161-162
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3227 Loosening of bolt-nut tightening system subjected to axial loading Three-dimensional finite element method study
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163-164
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3228 Strength of A5052/SUS304 Dissimilar Metals Diffusion Bonding Joint
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165-166
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3229 Evaluation of bolt-embedded knitfabric/Aluminum alloy co-cured joint
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167-168
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3230 Loosening and sliding behavior of bolt fastener under transverse loading
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169-170
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3231 Evaluation of mode II type crack suppression method for foam core sandwich panel with fracture toughness test and analyses
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171-172
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3232 Examination of plate's warp in riveting
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173-174
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3233 Evaluation of Loosening Proof Performances of Spring Washer by Three-dimensional Finite Element Analysis
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175-176
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3234 Influence of the Interlayer on the Free-Edge Singular Stress Field of Bonded Dissimilar Orthotropic Materials
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177-178
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3235 The Development of A Wrench to Measure The Clamping Force of A Bolted Joint Using A Commercial Torque Wrench
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179-180
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3236 Effect of Stress Field around interface Edge on Fatigue Strength of Aluminium Cast Alloy Locally Reinforced by SiC and Al_2O_3
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181-182
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3238 Welding Properties of SPCC/A1050P by Using Butt Laser Welding under Compression
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183-184
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3239 Fatigue Strength of Aluminum-Steel Rivet Joint under Tensile Shear Loading
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185-186
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3240 Stress Reduction Effect and Anti-loosening Performance of Outer Cap Nut
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187-188
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3241 Influence of Temperature and Thickness of Adhesive-tape on Strength of Adhesive Joint Under Combined Tension With Shear Loading
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189-190
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3242 An influence of variation in slant angle of side surface in three-dimensional joints upon stress singularity fields
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191-192
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3243 Measurement of Wheel Bolt Transverse Force
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193-194
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4319 Numerical simulation of Thermal Behavior of Natural Convection inside Thin Electronic Equipment Casing with different chimney materials
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195-196
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4320 Effect of Grease Application on Reduction of Thermal Contact Resistance : Measured Results under Low Mean Nominal Contact Pressure
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197-198
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4321 Effect of Hole Shape on Flow Resistance of Perforated in Natural Air Convection Flows
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199-200
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4322 Experimental Study on thermal behaviour in a Sealed Natural Air Cooled Electronic Equipment Casing
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201-202
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4323 Evaluation of Thermal Fatigue Damage and Microstructure Evolution in Flip Chip Interconnects by Synchrotron Radiation X-ray Micro-tomography
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203-204
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4324 Influence of Temperature and Strain on Phase Growth Process in Sn-3.0Ag-0.5Cu Solder Joints
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205-206
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4325 Development for a new implicit integration method of a material model for Lead-free solder alloys
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207-208
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4326 Strength Evaluation of Ag Paste for Die Bonding During Reflow Soldering
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209-210
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4327 Residual Stress Distribution in Stacked Chips Mounted by Flip Chip Technology
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211-212
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4328 Study on High Reliable Cu-bump Joint
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213-214
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4329 Residual Local Deformation of a Stacked Thin Si Chip Moiuntd by Flip Chip Technology
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215-216
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4330 Evaluation of stress-induced electronic characteristic changes of MOSFETs in resin-molded electronic packages
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217-218
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4331 Strain Measurement in Electronic Packages Using Digital Image Correlation
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219-220
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4332 Strength and Life Reliability on Semiconductor Substrate by Difference Bond Methods
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221-222
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4333 Thermo-viscoelastic analysis for warpage in laminated bodies
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223-224
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4334 Application of CAE to stress design for large LCD TV
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225-226
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奥付
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