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Improvement of Thickness Uniformity of Quartz Wafer by Numerically controlled Plasma CVM : Development of the NC-PCVM Machine and Acquisition of Machining Properties
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455-459
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Mechanism of Residual Stress Control in Thin Films by Means of Substrate Vibration
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460-465
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Research on Chemo-Mechanical-Grinding (CMG) of Si wafer : 2^<nd> Report : Generation of defect free surface on φ300mm Si wafer by fixed abrasive process
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466-470
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Basic Study on Development of A New Linear Guide System with Electrically Controllable Damping Using Liquid Crystalline Polymer : The Characteristics in Low Shearing Velocity Region
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471-476
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Smoothing 4H-SiC(0001)surface by EEM(Elastic Emission Machining)
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477-480
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Basic Study on Laser Forming (2nd Report)
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481-485
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A Study on Slicing Performance of Work Rotating Type Multi-Wire Saw : Fundamental Experiments on Characteristics of Bundled Workpieces Method
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486-490
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High Speed Dry End Milling of Titanium Alloys with Coated Carbide Tool
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491-495
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Control of the Residual Stress within a Machined Surface using a Tool for Compressive Residual Stress Generation
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496-500
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Cutting Characteristics of CBN Stone and Diamond Stone with Pulsed Nd:YAG Laser : Laser Cutting of Super Abrasive Stones
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501-505
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Trajectory Generation of Wheeled Mobile Robot by Repeatedly Direct Kinematics
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506-511
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A Calibration Method for Coordinate Measuring Machine using Parallel Mechanism : Calibration with Redundant Passive Prismatic Joint
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512-516
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Study on Basic Performance Comparison of Acoustic Holography and MUSIC Methods in Sound Source Identification
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517-522
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Precision Positioning of a Sawyer Motor-driven Stage : Proposal of the positioning system and experiments of micro-positioning
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523-527
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Development of Knowledge-code Converter for Activating Knowledge-based CAD
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528-532
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CONTENTS
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裏表紙
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目次
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