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表紙
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目次
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正誤表
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Challenge for electromechanical logic systems using compound semiconductor heterostructures(Plenary Session 1)
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1-4
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Nano-Electromechanical (NEM) Nonvolatile Memory for Low-Power Electronics(Session 1A : Emerging Device Technology 1)
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5-6
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Dual-gate ZnO thin-film transistors with SiNx as Dielectric Layer(Session 1A : Emerging Device Technology 1)
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7-8
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Piezoelectric material based passive RFID tags(Session 1A : Emerging Device Technology 1)
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9-10
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Low-temperature Epitaxial Growth of Ferromagnetic Silicide for SiGe Based Spintransistors(Session 1A : Emerging Device Technology 1)
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11-13
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Toward high-efficiency thin-film solar cells using semiconducting BaSi_2(Session 1A : Emerging Device Technology 1)
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15-19
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Applications of Smart Cut^<TM> Technologies to III-V Based Engineered Substrates
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21-22
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A New Cone-Type 1T DRAM Cell(Session 2A : Memory 1)
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23-25
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Dependence of Ag film thickness on Formation of Ag Nano-crystals to Fabricate Polymer Nonvolatile Memory(Session 2A : Memory 1)
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27-30
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The Impact of H_2 Anneal on Resistive Switching in Pt/TiO_2/Pt Structure(Session 2A : Memory 1)
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31-36
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Threshold Voltage Roll-off Mechanisms in SONOS Flash Memory in Retention Mode Including Trapped Charge Redistribution Effect(Session 2A : Memory 1)
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37-40
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Vertical Organic Field Effect Transistors with an Additional Gate Insulation Structure between Active Layer and Gate Electrode(Session 3A : Emerging Device Technology 2)
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41-42
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Investigation of n-type pentacene based MOS diodes with ultra-thin metal interface layer(Session 3A : Emerging Device Technology 2)
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43-46
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Fundamental oscillations at 〜900 GHz with low bias voltages in RTDs having spike-doped structures(Session 3A : Emerging Device Technology 2)
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47-48
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Analysis of low loss and wideband characteristics for monolithic isolators using resonant tunneling diodes(Session 3A : Emerging Device Technology 2)
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49-53
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Investigation of Abnormal Drain Current Increase of Tunneling Field-Effect Transistors(Session 3A : Emerging Device Technology 2)
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55-56
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A design of Novel IGBT with Oblique Trench Gate(Session 3A : Emerging Device Technology 2)
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57-59
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Electrical Characteristics of Atomic Layer Deposited Tungsten Nitride Diffusion Barrier for Cu Interconnects(Session 3A : Emerging Device Technology 2)
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61-63
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Synthesis of wafer scale graphene layer for future electronic devices(Session 2B : Graphene and III-Vs)
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65-67
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Graphene Channel FET : A New Candidate for High-Speed Devices(Session 2B : Graphene and III-Vs)
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69-72
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Deoxyribonucleic Acid Sensitive Graphene Field-Effect Transistors(Session 2B : Graphene and III-Vs)
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73-74
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Fabrication of InP/InGaAs DHBTs with buried SiO_2 wires(Session 2B : Graphene and III-Vs)
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75-79
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Reliability study on the emitter-base junction for high-speed sub-micron InP HBTs(Session 2B : Graphene and III-Vs)
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81-84
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Electrochemical formation of InP porous structures for their application to photoelectric conversion devices(Session 2B : Graphene and III-Vs)
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85-89
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50-Gbit/s MUX/DEMUX IC modules using feed-trough type metal-wall package technique(Session 3B : High Speed and High Frequency Applications 1)
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91-96
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94 GHz Monolithic Down-Converter for FMCW Radar Sensor using Metamorphic HEMTs(Session 3B : High Speed and High Frequency Applications 1)
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97-100
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A Sub-Harmonic RF Transmitter Architecture with Simultaneous Power Combination and LO Leakage Cancellation(Session 3B : High Speed and High Frequency Applications 1)
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101-104
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RF Interconnect Technology for On-Chip and Off-Chip Communication(Session 3B : High Speed and High Frequency Applications 1)
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105-108
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Future perspective for the mainstream CMOS technology and their contribution to green technologies(Plenary Session 2)
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109-114
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High Transport Si/SiGe Heterostructures for CMOS Transistors with Orientation and Strain Enhanced Mobility(Session 4A : Channel Engineering)
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115-118
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III-V/Ge CMOS technologies and heterogeneous integrations on Si platform(Session 4A : Channel Engineering)
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119-124
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Stress and Surface Orientation Engineering in Scaled CMOSFETs Considering High-Field Carrier Transport(Session 4A : Channel Engineering)
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125-129
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Si single-dopant devices and their characterization(Session 5A : Emerging Device Technology 3)
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131-136
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Investigation on fabrication of nanoscale patterns using laser interference lithography(Session 5A : Emerging Device Technology 3)
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137-140
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Bottom-up synthesis of metal-free elementary semiconductor nanowires(Session 5A : Emerging Device Technology 3)
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141-142
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Fabrication of Oxide Thin Film Transistor based on SOG dielectric and solution ZnO(Session 6A : TFTs and Sensors)
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143-146
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Device Simulation of Amorphous Indium-Gallium-Zinc-Oxide Thin Film transistors with various interfacial Dielectric layers(Session 6A : TFTs and Sensors)
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147-148
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Acivation behaviour for doped Si films after laser or furnace annealing(Session 6A : TFTs and Sensors)
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149-153
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Strain effects in resistor stress sensor fabricated on (001) silicon and their influences on the determination of piezoresistive coefficients(Session 6A : TFTs and Sensors)
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155-160
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Fabrication of gas sensor using Pd doped SnO_2 nanofibers(Session 6A : TFTs and Sensors)
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161-162
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Analysis of Transfer Gate in CMOS Image Sensor(Session 6A : TFTs and Sensors)
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163-164
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Interaction of bis-diethylaminosilane with a hydroxylized Si (001) surface for SiO_2 thin-film growth using density functional theory(Session 7A : Gate Oxides)
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165-168
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Electrical and structural properties of metal oxide semiconductor (MOS) devices with Pt/Ta_2O_5 gate stacks(Session 7A : Gate Oxides)
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169-172
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Modulation of PtSi work function by alloying with low work function metal(Session 7A : Gate Oxides)
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173-176
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The Analysis of Temperature Dependency of the Mobility In High-k/Metal Gate MOSFET and the Performance on its CMOS Inverter(Session 7A : Gate Oxides)
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177-182
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High Integrity Gate Insulator Films on Atomically Flat Silicon Surface(Session 7A : Gate Oxides)
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183-188
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Characterization of Mg Diffusion into HfO_2/SiO_2/Si(100) Stacked Structures and Its Impact on Detect State Densities(Session 7A : Gate Oxides)
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189-194
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Evaluation of 1/f Noise Characteristics in High-k/Metal Gate and SiON/Poly-Si Gate MOSFET(Session 7A : Gate Oxides)
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195-198
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High-k materials and poly-Si nanowires in nonvolatile memory for 3D flash memory and display panel applications(Session 8A : Memory 2)
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199-204
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A Single Element Phase Change Memory(Session 8A : Memory 2)
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205-209
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Impact of Floating Body type DRAM with the Vertical MOSFET(Session 8A : Memory 2)
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211-216
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Independent Gate Twin-bit SONOS Flash Memory with Split-gate Effect(Session 8A : Memory 2)
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217-220
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Theoretical Study of the Hydrogen Effect on the Program/Erase Cycle of MONOS-Type Memories(Session 8A : Memory 2)
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221-224
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The optimum physical targets of the 3-dimensional vertical FG NAND flash memory cell arrays with the extended sidewall control gate (ESCG) structure.(Session 8A : Memory 2)
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225-230
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New Method for Evaluating the Scaling Trend of Nano-Electro-Mechanical (NEM) Nonvolatile Memory Cells(Session 8A : Memory 2)
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231-232
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Development of Low on-resistance SiC Trench MOSFET and other SiC power devices(Session 6B : Wide Bandgap Materials and Devices, Power Devices)
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233-236
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Effects of Field Plate and Buried Gate Structures on Silicon Carbide Metal-Semiconductor Field-Effect Transistors(Session 6B : Wide Bandgap Materials and Devices, Power Devices)
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237-240
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InAlN/GaN HEMT Structures on 4-in Silicon Grown by MOCVD(Session 6B : Wide Bandgap Materials and Devices, Power Devices)
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241-244
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A comparative study on AlGaN/GaN based HEMT and MIS-HEMT with Al_2O_3 as gate dielectric(Session 6B : Wide Bandgap Materials and Devices, Power Devices)
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245-248
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Characterization of deep electron levels of AlGaN grown by MOVPE(Session 6B : Wide Bandgap Materials and Devices, Power Devices)
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249-252
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Characteristics of GaN p-n diode with damage layer induced by ICP plasma process(Session 6B : Wide Bandgap Materials and Devices, Power Devices)
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253-256
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The Impact of Current Controlled-MOS Current Mode Logic/Magnetic Tunnel Junction Hybrid Circuit for Stable and High-speed Operation(Session 7B : Si IC and Circuit Technology)
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257-262
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Verification of Stable Circuit Operation of 180nm Current Controlled MOS Current Mode Logic under Threshold Voltage Fluctuation(Session 7B : Si IC and Circuit Technology)
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263-267
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A Non-snapback NMOS ESD Clamp Circuit using Gate-Coupled Scheme with Isolated Well in a Bipolar-CMOS-DMOS Process(Session 7B : Si IC and Circuit Technology)
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269-274
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A Precision Floating-Gate Mismatch Measurement Technique for Analog Application(Session 7B : Si IC and Circuit Technology)
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275-278
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A Physical-Based Modeling for Accurate Wide-Width LDMOS(Session 7B : Si IC and Circuit Technology)
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279-282
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Over 1GHz High-Speed Current Pulse Generation Circuit for Novel Nonvolatile Memory Cells(Session 7B : Si IC and Circuit Technology)
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283-288
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A V-band Common-Source Low Noise Amplifier in a 0.13 μm RFCMOS Technology(Session 8B : High Speed and High Frequency Applications 2)
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289-292
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A 0.18 μm CMOS process 10-PAM transceiver for 10 Gigabit Ethernet(Session 8B : High Speed and High Frequency Applications 2)
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293-296
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A Switched-Capacitor Integrator Using Dynamic Source-Follower Amplifiers(Session 8B : High Speed and High Frequency Applications 2)
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297-300
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A Basic Study on RF Characteristics of Short Wavelength Comb-type Capacitive Transmission Line on MMIC(Session 8B : High Speed and High Frequency Applications 2)
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301-302
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High Current Drivability FD-SOI CMOS with Low Source/Drain Series Resistance(Session 9B : Nano-Scale devices and Physics)
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303-308
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Study on Impurity Distribution Dependence of Electron-Dynamics in Vertical MOSFET(Session 9B : Nano-Scale devices and Physics)
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309-313
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Characteristic of Dual-Gate Single Electron Transistor (DG-SET) with extended channel using shallow doping and sidewall patterning for suppressing MOS current(Session 9B : Nano-Scale devices and Physics)
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315-318
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Study on Collective Electron Motion in Si-Nano Dot Floating Gate MOS Capacitor(Session 9B : Nano-Scale devices and Physics)
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319-324
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複写される方へ
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奥付
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裏表紙
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