IEICE technical report. EMD The Institute of Electronics, Information and Communication Engineers 97(263) (19970919)

表紙 Full Text: CiNii
目次 Full Text: CiNii
Study of Deposition Processes with Silica-based PLC Chip Full Text: CiNii	1-6
Extended Bookshelf Packaging system using high-speed front interconnection Full Text: CiNii	7-11
Diamond in electronic materials : Its thermal property and electrical characteristic Full Text: CiNii	13-19
SMT (Surface Mountable) Optical Module for Subscriber Network Full Text: CiNii	21-26
Surface Analysis by TOF-SIMS Full Text: CiNii	27-32
[OTHERS] Full Text: CiNii