sponsored by ISHM--the Microelectronics Society, the International Electronics Packaging Society ; in cooperation with IEEE/Components, Hybrids, and Materials Technology Section, IPC--the Institute for Interconnecting and Packaging Electronic Circuits ; endorsed by EIA--Electronic Industrial Association
International Society for Hybrid Microelectronics , International Electronics Packaging Society
c1993
Proceedings / SPIE -- the International Society for Optical Engineering
v. 1986
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