Search Results1-20 of  21

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  • 于 強 ID: 9000002846061

    Articles in CiNii:2

    • 18) 2C3 : シミュレーション・評価(1) (2. 会議の概要, MES '99 報告, 第 9 回マイクロエレクトロニクスシンポジウム) (2000)
    • 10)2B-3 シミュレーション・信頼性I (3. 一般講演の概要, MES '98 報告, 第 8 回マイクロエレクトロニクスシンポジウム) (1999)
  • 于 強 ID: 9000015489978

    Articles in CiNii:1

    • 実用非線形最適化手法と構造システムの最適設計 (2003)
  • 于 強 ID: 9000016064161

    Articles in CiNii:1

    • モノづくりにおけるCAEの活用例 (特集 金型づくりにCAEを上手に使いこなす方法) (2004)
  • 于 強 ID: 9000018915099

    Articles in CiNii:2

    • 技術と産業を創出するKASTの研究成果(第8回)「次世代パワーエレクトロニクス」プロジェクト(2)プロジェクト期間 : 2008.4~2011.3 パワーモジュールの信頼性の評価技術(上) (2012)
    • 技術と産業を創出するKASTの研究成果(第9回))「次世代パワーエレクトロニクス」プロジェクト(2)プロジェクト期間 : 2008.4~2011.3 パワーモジュールの信頼性の評価技術(下) (2012)
  • 于 強 ID: 9000025061496

    Articles in CiNii:1

    • New reliability evaluation methodology sheds light on interactions among design factors (2009)
  • 于 強 ID: 9000251863001

    Articles in CiNii:1

    • Proposal of the application of the delamination test to semiconductor package design (2013)
  • 于 強 ID: 9000251863704

    Articles in CiNii:1

    • Analytical Study on Dispersion of Thermal Fatigue Life of IVH (Interstitial Via Hole) in PWB (Printed Wiring Board) (2011)
  • 于 強 ID: 9000251864851

    Articles in CiNii:1

    • A study on decision method for thermal boundary condition and life of Power Device (2013)
  • 于 強 ID: 9000364986028

    Articles in CiNii:1

    • 409 ナノスクラッチ試験によるSi_3N_4/Cu薄膜界面の界面強度評価(破壊の発生とその評価,破壊の発生・進展とその評価および抑制,オーガナイスドセッション・8,第53期学術講演会) (2004)
  • YU Qiang ID: 1000080242379

    Yokohama National University (2013 from CiNii)

    Articles in CiNii:304

    • Estimation of Strength Reliability of Surface Mount Solder Joints (1997)
    • Isolation of Orientia tsutsugamushi from Leptotrombidium fuji and Its Characterization (2000)
    • Optimization for Reducing Sound Radiation from the Vibrating Structure (2000)
  • YU Qiang ID: 9000020527581

    Articles in CiNii:1

    • Nonsteady Thermal Stress Analysis and Thermal Fatigue Strength of Metal-CFRP Bonded Joints. (1991)
  • YU Qiang ID: 9000020552297

    Articles in CiNii:1

    • Thermal Fatigue Strength Estimation of Metal-CFRP Bonded Joints. 2nd Report. Estimation by Experimental Method of Mechanical Fatigue. (1992)
  • YU Qiang ID: 9000020554450

    Articles in CiNii:1

    • Low-temperature strength of metal-FRP bonded joints. (1990)
  • YU Qiang ID: 9000020829962

    Articles in CiNii:1

    • Evaluation of Diffusion Creep in Low Melting Point Materials by Nanoindentation Creep Test (2005)
  • YU Qiang ID: 9000256072883

    Department of Systems Design, Division of Systems Research, Faculty of Engineering, Yokohama National University (2007 from CiNii)

    Articles in CiNii:20

    • Effects of BGA Solder Geometry on Fatigue Life and Reliability Assessment. (1998)
    • Low-Temperature Bonding Technique Using Sub-Micron Au Particles (2007)
    • Trends of Inspection & Reliability Technologies. Mechanical Reliability of Electronics Packaging. (1999)
  • YU Qiang ID: 9000259310984

    Articles in CiNii:20

    • Effect of Heterogeneity of Laminated Structure in FR-4 on Thermal Fatigue Life of Interstitial Via Hole in Printed Wiring Board : Second Report, Mechanism of Combinational Effect of Variation Factors and its Application to Design Techniques (2013)
    • Influence of Sintering Conditions on Mechanical Property Variations of Sintered Material (2015)
    • Precision Evaluation for Reliability of Power Module Using Coupled Electrical-Thermal-Mechanical-Analysis (2014)
  • YU Qiang ID: 9000356511968

    Articles in CiNii:1

    • 606 The Study on Extraction Method for Design Principle of Suspension System in the Tire Posture Control (2006)
  • YU Qiang ID: 9000356512338

    Articles in CiNii:1

    • 116 Mechanism of Damage Process on Interface between Films in Nanoscratch Test (2005)
  • YU Qiang ID: 9000356513355

    Articles in CiNii:1

    • Mechanical Reliability of Micro Joints in Electronics Package (2000)
  • Yu Qiang ID: 9000347144295

    横浜国立大学 (2015 from CiNii)

    Articles in CiNii:10

    • Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Properties (2011)
    • Fatigue life evaluation Using power device computing model (2011)
    • Reliability Evaluation of Electronic Devices under Considering the Actual use conditions (2011)
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