Search Results1-6 of  6

  • IDO Osamu ID: 9000002845956

    Articles in CiNii:10

    • Eveluation of Warp of Printed Wiring Board under Reflow Soldering (1997)
    • 携帯電話開発へのシミュレーションの適用 (特集:インターネット時代の開発スピードを実現する設計シミュレーション) -- (製品への適用) (2000)
    • 鋼球落下による基板の衝撃強度信頼性評価 (特集2:VPS・物理シミュレーション) (2004)
  • IDO Osamu ID: 9000002960159

    東京農工大学工学部 (1995 from CiNii)

    Articles in CiNii:1

    • Surface Profile Measurement by Optical Heterodyne Interferometry using Acousto-Optic Modulator (1995)
  • IDO Osamu ID: 9000256072736

    Production Technology Div., Fujitsu Ltd. (1997 from CiNii)

    Articles in CiNii:1

    • Evaluation of Warp of Printed Wiring Board under Reflow Soldering. (1997)
  • IDO Osamu ID: 9000256073324

    Manufacturing System Engineering Group, Fujitsu Ltd. (1999 from CiNii)

    Articles in CiNii:1

    • The Peeling Strength Evaluation of the BGA/CSP Solder Joints. (1999)
  • IDO Osamu ID: 9000256073688

    Packaging Technology Development Div., Corporate Manufacturing Systems Engineering Group, FUJITSU Limited (2001 from CiNii)

    Articles in CiNii:1

    • Use of Numerical Simulations for Developing Portable Telephones (2001)
  • ido osamu ID: 9000283739297

    Fujitsu Limited (2004 from CiNii)

    Articles in CiNii:1

    • The evaluation of impact reliability for mobile equipments (2004)
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