Search Results1-16 of  16

  • 坂本 博夫 ID: 9000009936867

    Articles in CiNii:2

    • 有限要素法のモデル化技術(17)事例に学ぶ (2004)
    • 携帯電話における実装部品の疲労強度設計 (特集2 モバイル機器を解剖する!携帯機器の各種試験・分析法) (2006)
  • 坂本 博夫 ID: 9000009937726

    Articles in CiNii:2

    • 移動通信機器用はんだ接合技術 (特集2 先進モジュール実装技術) (2004)
    • "D903i"の大画面スライド機薄型化技術 (2007)
  • 坂本 博夫 ID: 9000243770221

    三菱電機先端技術総合研究所機械システム技術部 (2011 from CiNii)

    Articles in CiNii:1

    • F122003 電機製品における設計([F12200](設計工学・システム部門企画),多目的最適化は設計につかえるか?) (2011)
  • SAKAMOTO Hiroo ID: 9000003629566

    Articles in CiNii:36

    • Prediction of flow direction by thermal analysis and coupling with structural analysis in FRP (2011)
    • 303 小型 3 点曲げセラミックス試験片の高温下き裂開口変位計測 (1995)
    • Investigation of Practical Method of Structural Optimization by Using GA (Proposition of Hybrid GA and Application to Thickness Optimization of a CRT) (2000)
  • SAKAMOTO Hiroo ID: 9000014617705

    Mitsubishi Electric Corp. (2008 from CiNii)

    Articles in CiNii:2

    • Quality Improvement of GaAs Chips Die-Bonding Using AuSn Solder with Interface Reaction Control (2008)
    • 2411 Proposition of Prediction Method for Fiber Orientation and Coupling with Structural Analysis in Fiber-Reinforced Plastics (2008)
  • SAKAMOTO Hiroo ID: 9000019941947

    Advanced Technology R&D Center, Mitsubishi Electric Corporation (2012 from CiNii)

    Articles in CiNii:1

    • Structural Design for Racks of Photovoltaic Array (2012)
  • SAKAMOTO Hiroo ID: 9000021336957

    Advanced Tech. R & D Center, Mitsubishi Electric Corp. (2007 from CiNii)

    Articles in CiNii:1

    • Bonding Strength Evaluation for Hermetic Seal of MEMS Package (2007)
  • SAKAMOTO Hiroo ID: 9000021347303

    Mitsubishi Electric Co., Advanced Tech. R & D Center (2007 from CiNii)

    Articles in CiNii:1

    • Evaluation of Mechanical Properties and Nano-Structure Analysis of Au-20Sn and Au-12Ge Solders (2007)
  • SAKAMOTO Hiroo ID: 9000021521971

    Mitsubishi Electric Corp. Advanced Technology R&D Center (2011 from CiNii)

    Articles in CiNii:1

    • Mechanism of Warpage Increase Behavior Induced by Thermal Cycling in Semiconductor Package (2011)
  • SAKAMOTO Hiroo ID: 9000243770257

    Mitsubishi Electric Corporation (2011 from CiNii)

    Articles in CiNii:1

    • G010022 Stress evaluation of the glass hit by the hail using impact analysis (2011)
  • SAKAMOTO Hiroo ID: 9000256278471

    Advanced Technology R & D Center, Mitsubishi Electric Corporation (2004 from CiNii)

    Articles in CiNii:1

    • Study of Ultrasonic Vibration of Rice Cooking Pot by Induction Heating (2004)
  • SAKAMOTO Hiroo ID: 9000290376817

    Mitsubishi Electric Corporation (2011 from CiNii)

    Articles in CiNii:1

    • 2401 Reliability design for racks of photovoltaic modules (2011)
  • SAKAMOTO Hiroo ID: 9000304000272

    三菱電機 (2012 from CiNii)

    Articles in CiNii:1

    • GS23 Evaluation of strength degradation of silicone glue under high-humidity conditions (2012)
  • SAKAMOTO Hiroo ID: 9000308044832

    Mitsubishi Electric Corp. (2013 from CiNii)

    Articles in CiNii:1

    • 412 Mechanism of Warpage Increase Behavior Induced by Thermal Cycling in Semiconductor Package (2013)
  • SAKAMOTO Hiroo ID: 9000386213983

    Mitsubishi Electric Corporation (2017 from CiNii)

    Articles in CiNii:1

    • Proposal of Systematic Design Method of Loosening in Bolted Joint (2017)
  • SAKAMOTO Hiroo ID: 9000402620816

    Mitsubishi Electric Corporation (2018 from CiNii)

    Articles in CiNii:1

    • A Study on Design Guidelines for Bolted Joints Using Spring Washer (2018)
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