Search Results1-20 of  24

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  • 宝川 幸司 ID: 9000008215317

    Articles in CiNii:3

    • SAWを用いた電圧制御マルチバイブレ-タ(技術談話室) (1979)
    • 干渉計直結形ジョセフソン論理ゲ-ト (1983)
    • 抵抗分割形2/3多数決ジョセフソン論理ゲ-ト (1984)
  • 宝川 幸司 ID: 9000009469306

    Articles in CiNii:1

    • Piezoelectric Sensor Using a Porous Alumina Film Covered with a Catalytic material (学外発表論文) -- (第3プロジェクト〔複合インテリジェント集積素子の研究開発〕関係) (2000)
  • HOHKAWA Kohji ID: 1000030257406

    Kanagawa Institute of Tech. (2009 from CiNii)

    Articles in CiNii:94

    • Fabrication of Si/LiNbO_3 Structure by Using Film Bonding Process (2001)
    • Study on High Frequency SAW Device Fabricated on Epitaxitially grown GaN (2005)
    • Ultra-violet Response of GaN SAW Device (2005)
  • HOHKAWA Kohji ID: 9000253647634

    NTT Transmission Systems Laboratories (1989 from CiNii)

    Articles in CiNii:1

    • Applications of superconducting interconnection in LSIs. (1989)
  • HOHKAWA Kohji ID: 9000398971217

    Articles in CiNii:1

    • PC23 SAW Multi-Phase Sift keying MODEM Circuis (1993)
  • HOUKAWA Kouji ID: 9000253675563

    日本電信電話公社 武蔵野電気通信研究所 (1976 from CiNii)

    Articles in CiNii:1

    • Microwave Acoustics R & D of Saw Devices (1976)
  • Hohkawa K. ID: 9000398971716

    Articles in CiNii:1

    • PB-17 Study on SAW devices for a pulse position modulated direct sequence Spread Spectrum communication system (1994)
  • Hohkawa K. ID: 9000398972795

    Articles in CiNii:1

    • PF6 Study on the microscopic surface structure of a quartz substrate for SAW device (1996)
  • Hohkawa K. ID: 9000398974473

    Articles in CiNii:1

    • C-2 Photo-responce of SAW device with AlGaAs/LiNbO_3 structure (1999)
  • Hohkawa K. ID: 9000398974556

    Articles in CiNii:1

    • PC-6 Fabrication of SAW-semiconductor coupled devices using epitaxial lift-off technology (1999)
  • Hohkawa K. ID: 9000398974730

    Articles in CiNii:1

    • PF05 Fabrication of SAW functional devices with semiconductor-piezoelectric structure (2000)
  • Hohkawa K. ID: 9000398974742

    Articles in CiNii:1

    • PF06 Fabrication process of SAW-semiconductor coupled devices using ELO film bonding (2000)
  • Hohkawa K. ID: 9000398975462

    Articles in CiNii:1

    • P2-17 X-ray analysis of SAW-semiconductor coupled devices (2001)
  • Hohkawa K. ID: 9000398975700

    Articles in CiNii:1

    • P3-38 Functional SAW device integrated with semiconductor active devices (2001)
  • Hohkawa K. ID: 9000398975725

    Articles in CiNii:1

    • P3-39 Programmable SAW-semiconductor correlator with multi-strip structure (2001)
  • Hohkawa K. ID: 9000398976214

    Articles in CiNii:1

    • P3-48 Study on 2-Dimensional Acoustic Functional Devices with Periodic Structure (2002)
  • Hohkawa K. ID: 9000398976229

    Articles in CiNii:1

    • P3-40 Design on Semiconductor Coupled SAW Programmable Filter (2002)
  • Hohkawa K. ID: 9000398976722

    Articles in CiNii:1

    • P1-34 Study on Integration of Acoustic-optic Functional Devices and Semiconductor Devices (2002)
  • Hohkawa Kohji ID: 9000004667726

    Articles in CiNii:6

    • 線形計画法による弾性表面波フィルタの設計 (1977)
    • 重み付け損失を軽減した弾性表面波フィルタ (1979)
    • 同一の電極パタ-ンをもった複数個の弾性表面波共振器を用いた温度補償発振器 (1979)
  • Hohkawa Kohji ID: 9000398972317

    Articles in CiNii:1

    • PC5 Residuals caused by the CF4 gas plusma etching process (1995)
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