Search Results1-20 of  29

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  • 折井 靖光 ID: 9000008210868

    Articles in CiNii:1

    • 低コストフリップチップ実装技術の開発と適用事例 (実装技術ガイドブック2002年--CSP,ビルドアップ基板,はんだ付けなど実装技術を集大成(付録 実装技術関連企業一覧表)) -- (最先端実装技術編) (2002)
  • 折井 靖光 ID: 9000253693665

    Articles in CiNii:1

    • レーザープロセッシング (1993)
  • 折井 靖光 ID: 9000356626868

    Articles in CiNii:1

    • Development of liquid photoresist for IMS (Injection Molded Solder) with high thermal stability (2017)
  • 折井 靖光 ID: 9000406308400

    日本アイ・ビー・エム (2014 from CiNii)

    Articles in CiNii:1

    • Novel Bump Formation Process by Using Photoresist with High Heat Resistance and High Resolution (2014)
  • 折井 靖光 ID: 9000406308409

    IBM Japan, IBM Research Tokyo, Science & Technology (2014 from CiNii)

    Articles in CiNii:1

    • A fine pitch solder bumping technology on wafers with molten solder injection method (2014)
  • 折井 靖光 ID: 9000409878529

    日本アイ・ビー・エム (2012 from CiNii)

    Articles in CiNii:1

    • Improvement of the accuracy of the nonlinear finite element analyses for a 3D SIC package using the thermal strain measurement with scanning electron microscope and the digital image correlation. (2012)
  • 折井 靖光 ID: 9000409879020

    日本アイ・ビー・エム (2012 from CiNii)

    Articles in CiNii:1

    • Bump Structure Study for Fine Pitch Flip Chip Interconnection (2012)
  • 折井 靖光 ID: 9000409879127

    日本アイ・ビー・エム (2013 from CiNii)

    Articles in CiNii:1

    • Analyses of 3D die-stack package: thermal stress and electromigration (2013)
  • 折井 靖光 ID: 9000409879147

    日本アイ・ビー・エム (2013 from CiNii)

    Articles in CiNii:1

    • Feasibility study of micro-solder bumping with Injection Molded Solder technology (2013)
  • 折井 靖光 ID: 9000412192154

    日本アイ・ビー・エム (2008 from CiNii)

    Articles in CiNii:1

    • Effects of warpage and underfill material on assembly and reliability of System-in-Package (2008)
  • 折井 靖光 ID: 9000412192861

    超先端電子技術開発機構 (2011 from CiNii)

    Articles in CiNii:1

    • Joining Method for Thin Si Chips (2011)
  • 折井 靖光 ID: 9000412192913

    日本アイ・ビー・エム (2011 from CiNii)

    Articles in CiNii:1

    • Mechanical simulation for Pre-applied Underfill process (2011)
  • 折井 靖光 ID: 9000413383620

    Articles in CiNii:1

    • Materials Informatics through Multifaceted approach utilizing SaaS (2021)
  • ORII Yasumitsu ID: 9000005060419

    ASET (2013 from CiNii)

    Articles in CiNii:33

    • Characteristics of Debris Formation During Laser Ablation and a Practical Method for Removing the Debris (1995)
    • Flip Chip Attach Technology for Fine Pitch Connection by In Alloy Solder (1997)
    • Thermal characterization of a three-dimensional (3D) chip stack (2010)
  • ORII Yasumitsu ID: 9000107312937

    Articles in CiNii:1

    • Electromigration (2012)
  • ORII Yasumitsu ID: 9000252925489

    Yasu Plant, IBM Japan, Ltd. (1995 from CiNii)

    Articles in CiNii:1

    • Characteristics of Debris Formation During Laser Ablation and a Practical Method for Removing the Debris. (1995)
  • ORII Yasumitsu ID: 9000254664624

    IBM Japan (1998 from CiNii)

    Articles in CiNii:1

    • Shear Property of Solders for Flip Chip Joining. (1998)
  • ORII Yasumitsu ID: 9000254664685

    IBM Japan (1998 from CiNii)

    Articles in CiNii:1

    • Microstructure and Thermal Fatigue Behavior of Flip Chip Joint by Gold Bump. (1998)
  • ORII Yasumitsu ID: 9000255716374

    Card Engineering, IBM Japan, Ltd. Yasu (1997 from CiNii)

    Articles in CiNii:1

    • Flip Chip Attach Technology for Fine Pitch Connection by In Alloy Solder. (1997)
  • ORII Yasumitsu ID: 9000304001411

    IBM Research Tokyo, Electronic & Optical Packaging (2012 from CiNii)

    Articles in CiNii:1

    • OS1801 Trends and Technical Challenge for 2.5D/3D IC Packaging (2012)
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