Search Results1-18 of  18

  • 折井 靖光 ID: 9000008210868

    Articles in CiNii:1

    • 低コストフリップチップ実装技術の開発と適用事例 (実装技術ガイドブック2002年--CSP,ビルドアップ基板,はんだ付けなど実装技術を集大成(付録 実装技術関連企業一覧表)) -- (最先端実装技術編) (2002)
  • 折井 靖光 ID: 9000253693665

    Articles in CiNii:1

    • レーザープロセッシング (1993)
  • 折井 靖光 ID: 9000338428892

    Articles in CiNii:1

    • Novel Bump Formation Process by Using Photoresist with High Heat Resistance and High Resolution (2014)
  • 折井 靖光 ID: 9000338428936

    Articles in CiNii:1

    • A fine pitch solder bumping technology on wafer with molten solder injection method (2014)
  • 折井 靖光 ID: 9000356626868

    Articles in CiNii:1

    • Development of liquid photoresist for IMS (Injection Molded Solder) with high thermal stability (2017)
  • ORII Yasumitsu ID: 9000005060419

    ASET (2013 from CiNii)

    Articles in CiNii:33

    • Characteristics of Debris Formation During Laser Ablation and a Practical Method for Removing the Debris (1995)
    • Flip Chip Attach Technology for Fine Pitch Connection by In Alloy Solder (1997)
    • Thermal characterization of a three-dimensional (3D) chip stack (2010)
  • ORII Yasumitsu ID: 9000107312937

    Articles in CiNii:1

    • Electromigration (2012)
  • ORII Yasumitsu ID: 9000252925489

    Yasu Plant, IBM Japan, Ltd. (1995 from CiNii)

    Articles in CiNii:1

    • Characteristics of Debris Formation During Laser Ablation and a Practical Method for Removing the Debris. (1995)
  • ORII Yasumitsu ID: 9000254664624

    IBM Japan (1998 from CiNii)

    Articles in CiNii:1

    • Shear Property of Solders for Flip Chip Joining. (1998)
  • ORII Yasumitsu ID: 9000254664685

    IBM Japan (1998 from CiNii)

    Articles in CiNii:1

    • Microstructure and Thermal Fatigue Behavior of Flip Chip Joint by Gold Bump. (1998)
  • ORII Yasumitsu ID: 9000255716374

    Card Engineering, IBM Japan, Ltd. Yasu (1997 from CiNii)

    Articles in CiNii:1

    • Flip Chip Attach Technology for Fine Pitch Connection by In Alloy Solder. (1997)
  • ORII Yasumitsu ID: 9000304001411

    IBM Research Tokyo, Electronic & Optical Packaging (2012 from CiNii)

    Articles in CiNii:1

    • OS1801 Trends and Technical Challenge for 2.5D/3D IC Packaging (2012)
  • ORII Yasumitsu ID: 9000399370198

    IBM Research-Tokyo (2016 from CiNii)

    Articles in CiNii:1

    • Solder-filled Through Silicon Via with Organic Insulator (2016)
  • Orii Yasumitsu ID: 9000265536444

    IBM Research Tokyo, Science & Technology (2014 from CiNii)

    Articles in CiNii:1

    • Introduction to the Special Edition (2014)
  • Orii Yasumitsu ID: 9000265536478

    IBM Research - Tokyo (2014 from CiNii)

    Articles in CiNii:1

    • Core Technologies for Breaking into Cognitive Computing Era (2014)
  • Orii Yasumitsu ID: 9000311505483

    IBM Research - Tokyo, IBM Japan, Ltd. (2015 from CiNii)

    Articles in CiNii:1

    • Development and Commercialization of Solder Bump Fabrication Technology with Molten Solder Injection Method (2015)
  • Orii Yasumitsu ID: 9000347144823

    IBM Research Tokyo (2011 from CiNii)

    Articles in CiNii:1

    • Technical Challenges for 3D-IC Packaging (2011)
  • Orii Yasumitsu ID: 9000397687237

    ASET (2014 from CiNii)

    Articles in CiNii:1

    • Fine-pitch Solder Joining for High Density Interconnection (2014)
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