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  • 東條 啓 ID: 9000412192285

    東芝 (2009 from CiNii)

    Articles in CiNii:1

    • Development of a novel discrete package by wafer level process (2009)
  • TOJO Akira ID: 9000003809935

    Muroran Institute of Technology (2005 from CiNii)

    Articles in CiNii:13

    • Shock Wave / Boundary Layer Interaction in a Supersonic Rectangular Duct : 2nd Report, PIV Measurement of the Shock Train (2002)
    • Investigation on Supersonic Internal Flows with Shock Waves (2003)
    • Study on Supersonic Internal Flows with Shock Waves : Experiment and Numerical Simulation on the Mach 2 Pseudo-Shock Wave (2003)
  • Tojo Akira ID: 9000347143525

    Toshiba Corporation, Corporate Manufacturing Engineering Center (2010 from CiNii)

    Articles in CiNii:1

    • Application of Laser Process for Semiconductor Packaging Technology (2010)
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