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  • 東谷 恵市 ID: 9000009331945

    Articles in CiNii:1

    • 高速LSI対応Cu&Al配線技術〔含 英文〕 (新しい地球環境と豊かなネットワーク社会を生み出す半導体技術) -- (セッション4 多層配線/エッチング--Cu/Low-k実用化が進む中での多層配線/エッチング技術動向) (1999)
  • HIGASHITANI Keiichi ID: 9000004959950

    Mitsubishi Electic Corporation, ULSI Laboratory, Evaluation Analysis Center (1995 from CiNii)

    Articles in CiNii:1

    • Effect of Plasma-Induced Damage on MOSFET Reliability (1995)
  • HIGASHITANI Keiichi ID: 9000004967351

    CANON INC.Device Development Center (2001 from CiNii)

    Articles in CiNii:3

    • The Best Combination of Aluminum and Copper Interconnects for a High Performance Logic Device (1998)
    • Cu interconnect technology for high performance system LSI (1999)
    • A 3.25M-pixel APS-C size CMOS Image Sensor (2001)
  • Higashitani Keiichi ID: 9000005322561

    MITSUBISHI Electric Corporation ULSI Development Center (2001 from CiNii)

    Articles in CiNii:1

    • A 3.25M-pixel APS-C size CMOS Image Sensor (2001)
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