Search Results1-12 of  12

  • 板橋 武之 ID: 9000258666579

    日立製作所 (2005 from CiNii)

    Articles in CiNii:1

    • コロイド法によるPtRuナノ粒子担持触媒の作製 (2005)
  • 板橋 武之 ID: 9000258666635

    日立製作所 (2005 from CiNii)

    Articles in CiNii:1

    • PtRuナノ粒子担持触媒作製における超音波照射の影響 (2005)
  • ITABASHI Takeyuki ID: 9000000107319

    Hitachi Research Laboratory, Hitachi Ltd. (1996 from CiNii)

    Articles in CiNii:1

    • Thin Film Laminated Multilayer Substrate (1996)
  • ITABASHI Takeyuki ID: 9000001836171

    (株)日立製作所 基礎研究所 環境エネルギーラボ (2006 from CiNii)

    Articles in CiNii:1

    • Present Status of Organic Solar Cells (2006)
  • ITABASHI Takeyuki ID: 9000002157002

    (株)日立製作所 基礎研究所 環境・エネルギーラボ (2007 from CiNii)

    Articles in CiNii:2

    • Development of Multilayer Evaluation System with Energy chain (2006)
    • Development of Multi-layered Evaluation Model with Energy Chain (II) (2007)
  • ITABASHI Takeyuki ID: 9000003015626

    Department of Electronic Materials and Devices Research, Hitachi Research Laboratory, Hitachi, Ltd. (2002 from CiNii)

    Articles in CiNii:3

    • Filling Profile Simulations for Copper Electroplating Process (2001)
    • Electroless deposited Co Alloy for Copper Diffusion Barrier Metal (2001)
    • Development of Formaldehyde Free Electroless Copper Plating Solution (2002)
  • ITABASHI Takeyuki ID: 9000018679935

    Hitachi Metals, Ltd. (2008 from CiNii)

    Articles in CiNii:1

    • 718 Crack Propagation Analysis of Cu-cored Solder Joint (2008)
  • ITABASHI Takeyuki ID: 9000256072216

    Hitachi Research Laboratory, Hitachi, Ltd. (1994 from CiNii)

    Articles in CiNii:1

    • Mechanism of Nodule Formation in Electroless Copper Deposition. (1994)
  • ITABASHI Takeyuki ID: 9000256072533

    Hitachi Research Laboratory, Hitachi Ltd. (1996 from CiNii)

    Articles in CiNii:1

    • Trends of MCM Application. New MCM Technology. Thin Film Laminated Multilayer Substrate. (1996)
  • ITABASHI Takeyuki ID: 9000256073922

    Department of Electronic Materials and Devices Research, Hitachi Research Laboratory, Hitachi, Ltd. (2002 from CiNii)

    Articles in CiNii:1

    • Development of Formaldehyde Free Electroless Copper Plating Solution. (2002)
  • Itabashi Takeyuki ID: 9000258391719

    Hitachi Research Laboratory, Hitachi Ltd. (2003 from CiNii)

    Articles in CiNii:1

    • Development of Copper Dissolution Method for Lengthening the Life of Electroless Copper Plating Bath (2003)
  • Itabashi Takeyuki ID: 9000391796279

    Hitachi Research Laboratory, Hitachi, Ltd. (2002 from CiNii)

    Articles in CiNii:1

    • Improvement in Reliability of Formaldehyde Free Full Build Electroless Copper Plating Technology (2002)
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