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  • SHIRASAKA Jun ID: 9000005062171

    Kumamoto University (2005 from CiNii)

    Articles in CiNii:2

    • Non-destructive Evaluation of Solder Ball Joints in BGA Package by Infrared Thermography (2005)
    • Nondestructive Evaluation of BGA Joints in Electronic Devices with Infrared Thermography (2000)
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