Search Results1-20 of  55

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  • 荘司 郁夫 ID: 9000005059680

    Articles in CiNii:2

    • 2003 Review of Welding in Japan (2004)
    • 2001 Review of Welding in Japan (2002)
  • 荘司 郁夫 ID: 9000019181922

    Articles in CiNii:1

    • 微量元素添加による鉛フリーはんだの高信頼性化 (2012)
  • 荘司 郁夫 ID: 9000019181981

    Articles in CiNii:1

    • 鉛フリーはんだによるフロー槽表面処理ステンレス鋼侵食評価の国際標準化 (特集 種々のニーズに応えて進化する最近の鉛フリーはんだ実装) (2012)
  • 荘司 郁夫 ID: 9000019233218

    Articles in CiNii:1

    • 特集「接着剤に親しむ」によせて (2012)
  • 荘司 郁夫 ID: 9000241736044

    Articles in CiNii:1

    • フローはんだ槽材料の長期信頼性評価 : 鉛フリーはんだによる表面処理ステンレス鋼の侵食評価試験方法の国際標準化 (2013)
  • 荘司 郁夫 ID: 9000242694731

    Articles in CiNii:1

    • Feasibility Study on Grain-oriented Electrode Materials with Effect of Inhibition of Interfacial Reaction (2006)
  • 荘司 郁夫 ID: 9000284276368

    Articles in CiNii:1

    • 2nd Laboratory, Materials System Science and Technology, Division of Mechanical Science and Technology, Faculty of Science and Technology, Gunma University (2015)
  • 荘司 郁夫 ID: 9000327444830

    Articles in CiNii:1

    • Development of IMC Pillar Dispersed Pb Free Solder Joint for Power Module (2015)
  • 荘司 郁夫 ID: 9000338427102

    Articles in CiNii:1

    • High Reliable Bonding Technology by Intermetallic Compound (IMC) Pillar Dispersed Lead-free Solder Joint (2016)
  • SHOHJI Ikuo ID: 9000002843531

    Graduate School of Engineering, Gunma University (2012 from CiNii)

    Articles in CiNii:25

    • Joint Strength and Microstructure of SUS304 Brazed with Nickel-base Filler Metal for Heat Exchangers (2004)
    • Ultrasonic Bonding of Resin-Coated Cu Wire for High-Frequency Chip Coils (2004)
    • Whisker-Free Pb-Free Solder through Alloying (2006)
  • SHOHJI Ikuo ID: 9000002845967

    Card Engineering, Yasu, IBM Japan, Ltd.:(Present address)Gunma University (2001 from CiNii)

    Articles in CiNii:24

    • Growth Kinetics of Intermetallic Compounds on the Boundary between Au and In-48Sn Solder (1998)
    • Flip Chip Attach Technology for Fine Pitch Connection by In Alloy Solder (1997)
    • エレクトロニクス実装におけるマイクロ接合の潮流と将来展望 (2000)
  • SHOHJI Ikuo ID: 9000006671268

    Graduate School of Engineering, Gunma University (2012 from CiNii)

    Articles in CiNii:3

    • Dissolution Properties of Cu in Sn-Cu-Ni and Sn-Zn Lead-Free Alloys (2011)
    • 208 Interfacial reaction between Sn-Ag-Cu-Ni-Ge lead-free solder and Cu electrode (2006)
    • Effect of Ge and P Addition in Sn-Ag-Cu-Ni Lead-Free Solder on the Solder Joint Properties (2012)
  • SHOHJI Ikuo ID: 9000020643700

    Department of Mechanical Engineering, Gunma University (2011 from CiNii)

    Articles in CiNii:1

    • Influence of Processing Temperature on Boriding of SUS304 Stainless Steel by Al Added Fused Salt Bath (2011)
  • SHOHJI Ikuo ID: 9000020933825

    Graduate School of Engineering, Gunma University (2012 from CiNii)

    Articles in CiNii:1

    • The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint (2012)
  • SHOHJI Ikuo ID: 9000248240987

    Graduate School of Engineering, Gunma University (2013 from CiNii)

    Articles in CiNii:1

    • The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint (2013)
  • SHOHJI Ikuo ID: 9000254664623

    IBM Japan (1998 from CiNii)

    Articles in CiNii:1

    • Shear Property of Solders for Flip Chip Joining. (1998)
  • SHOHJI Ikuo ID: 9000254664684

    IBM Japan (1998 from CiNii)

    Articles in CiNii:1

    • Microstructure and Thermal Fatigue Behavior of Flip Chip Joint by Gold Bump. (1998)
  • SHOHJI Ikuo ID: 9000255716370

    Card Engineering, IBM Japan, Ltd. Yasu (1997 from CiNii)

    Articles in CiNii:1

    • Flip Chip Attach Technology for Fine Pitch Connection by In Alloy Solder. (1997)
  • SHOHJI Ikuo ID: 9000255716619

    Card Engineering, IBM Japan, Ltd. Yasu (1999 from CiNii)

    Articles in CiNii:1

    • Growth Kinetics of Intermetallic Compounds on the Boundary between Au and In-Sn Alloys. (1999)
  • SHOHJI Ikuo ID: 9000256072806

    Card Engineering, Yasu, IBM Japan, Ltd. (1998 from CiNii)

    Articles in CiNii:1

    • Growth Kinetics of Intermetallic Compounds on the Boundary between Au and In-48Sn Solder. (1998)
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