Search Results1-5 of  5

  • 馬場 伸治 ID: 9000345208599

    新里クリニック浦上 (2016 from CiNii)

    Articles in CiNii:1

    • 疼痛とQOLの関連性について (2016)
  • 馬場 伸治 ID: 9000398277251

    ルネサスエレクトロニクス (2015 from CiNii)

    Articles in CiNii:1

    • Low Cost Flip-Chip Bonding Technology with Cu Pillar and NCF for Fine Pitch Products (2015)
  • BABA Shinji ID: 9000001380713

    Jisso Technology Development Dept., Renesas Technology Corp. (2005 from CiNii)

    Articles in CiNii:13

    • Reliability Study for 2000 Pin Class Flip-Chip BGA (2003)
    • 1.6Gバイト/秒高速1GビットシンクロナスDRAM設計技術 (特集"半導体") -- (メモリ) (1997)
    • ボ-ルグリッドアレ-パッケ-ジの最新技術 (特集"LSI") -- (基盤技術) (1998)
  • BABA Shinji ID: 9000255716920

    Assembly Engineering Dept., Manufacturing Technology & Production Management Div., Mitsubishi Electric Corp (2003 from CiNii)

    Articles in CiNii:1

    • Reliability Study for 2000 Pin Class Flip-Chip BGA (2003)
  • Baba Shinji ID: 9000254439537

    Mitsubishi Electric Corporation. Manufacturing Technology Div. (1995 from CiNii)

    Articles in CiNii:1

    • Chip Scale Package. (1995)
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