Search Results1-20 of  94

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  • AOYAGI Masahiro ID: 9000401510714

    Articles in CiNii:1

    • 招待講演 Stress Investigation of Annular-Trench-Isolated (ATI) Through Silicon Via (TSV) (シリコン材料・デバイス) (2019)
  • AOYAGI MASAHIRO ID: 9000258391868

    National Institute of Advanced Industrial Science and Technology(AIST) (2003 from CiNii)

    Articles in CiNii:1

    • Fabrication Technique of Fine Wiring Structure by Electrodeposited Polyimide (2003)
  • AOYAGI Masahiro ID: 9000001298807

    Yamaguchi University (2004 from CiNii)

    Articles in CiNii:2

    • Optimization of HTS coil configurations for Micro-SMES (2003)
    • Magnetic stiffness between magnetic source and HTS bulk exposed to its shifting magnetic field (2004)
  • AOYAGI Masahiro ID: 9000004871137

    National Institute of Advanced Industrial Science and Technology (2002 from CiNii)

    Articles in CiNii:7

    • Durable and Low Power-Loss Semiconductor Devices for Specific Automotive Applications (Special Issue on ASICs for Automotive Electronics) (1993)
    • A New Drive Circuit Built in a Multichip Module for Supplying a Two-Phase Power to Josephson LSI Circuits (1994)
    • Off-Chip Superconductor Wiring in Multichip Module for Josephson LSI Circuit (Special Section on Superconducting Devices) (1994)
  • AOYAGI Masahiro ID: 9000014659998

    High Density Interconnection Group, Nanoelectronics Research Institute(NeRI) National Institute of Advanced Industrial Science and Technology(AIST) (2009 from CiNii)

    Articles in CiNii:2

    • Bridge Connection for Facing Pads Arrays with Pad-position Shifts Using Controlled Extraneous Deposition of Electroless NiB (2009)
    • Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB (2006)
  • AOYAGI Masahiro ID: 9000107341022

    Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST) (2004 from CiNii)

    Articles in CiNii:1

    • Fabrication of High-Density Wiring Interposer for 10GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide (2004)
  • AOYAGI Masahiro ID: 9000107356494

    National Institute of Advanced Industrial Science and Technology (AIST), AIST Tsukuba Center 2 (2003 from CiNii)

    Articles in CiNii:1

    • Response of an On-Chip Coil-Integrated Superconducting Tunnel Junction to X-rays (2003)
  • AOYAGI Masahiro ID: 9000253323697

    Electrotechnical Laboratory. (1986 from CiNii)

    Articles in CiNii:1

    • Evaluation of IC-Spread of NbN Josephson Junctions Fabricated Using Two-Layer Resist System (1986)
  • AOYAGI Masahiro ID: 9000253324047

    Electrotechnical Laboratory. (1987 from CiNii)

    Articles in CiNii:1

    • Fabrication of Niobium Nitride Josephson Tunnel Junctions Which Can Be Operated at 15 K (1987)
  • AOYAGI Masahiro ID: 9000255717088

    Opto-Electronic System Integration Collaborative Research Team, Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology (2006 from CiNii)

    Articles in CiNii:1

    • High-Density Optical Backplane Using Small Diameter Optical Fiber (2006)
  • AOYAGI Masahiro ID: 9000317564937

    Nanoelectronics Research Institute, AIST (2016 from CiNii)

    Articles in CiNii:1

    • Developing an application for 3D IC chip stacking technology:— How to shift from fundamental to practical technology — (2016)
  • AOYAGI Masahiro ID: 9000325831357

    Nanoelectronics Research Institute, AIST (2016 from CiNii)

    Articles in CiNii:1

    • Developing a leading practical application for 3D IC chip stacking technology:— How to progress from fundamental technology to application technology — (2016)
  • Aoyagi Masahiro ID: 9000020181536

    National Institute of Advanced Industrial Science and Technology (AIST)|Graduate School of Science and Technology, Tokyo University of Science (2009 from CiNii)

    Articles in CiNii:1

    • Formation of Au Microbump Arrays for Flip-Chip Bonding Using Electroless Au Deposition from a Non-Cyanide Plating Bath (2009)
  • Aoyagi Masahiro ID: 9000021371617

    High Density Interconnection Group, Nanoelectronics Research Institute (NeRI) National Institute of Advanced Industrial Science and Technology (AIST) (2008 from CiNii)

    Articles in CiNii:1

    • Chemical flip-chip bonding method for fabricating 10-.MU.m-pad-pitch interconnect (2008)
  • Aoyagi Masahiro ID: 9000252758389

    Articles in CiNii:1

    • All Niobium Nitride Josephson Junction with Hydrogenated Amorphous Silicon Barrier and its Application to the Logic Circuit (1984)
  • Aoyagi Masahiro ID: 9000252765506

    Electrotechnical Laboratory (1992 from CiNii)

    Articles in CiNii:1

    • NbN/MgO/NbN Josephson Junctions for Integrated Circuits (1992)
  • Aoyagi Masahiro ID: 9000252766231

    Electrotechnical Laboratory (1992 from CiNii)

    Articles in CiNii:1

    • Liquid-Nitrogen-Cooled Dry Etching of YBaCuO Thin Films (1992)
  • Aoyagi Masahiro ID: 9000252960666

    Electrotechnical Laboratory (1987 from CiNii)

    Articles in CiNii:1

    • Integrated DC–SQUID Magnetometer (1987)
  • Aoyagi Masahiro ID: 9000252977823

    Electrotechnical Laboratory (1991 from CiNii)

    Articles in CiNii:1

    • Properties of Large-Sized Nb-Based Superconducting Tunnel Junctions for X-Ray Detection (1991)
  • Aoyagi Masahiro ID: 9000252982092

    Electrotechnical Laboratory (1992 from CiNii)

    Articles in CiNii:1

    • Palladium Thin-Film Resistors for Josephson LSI Circuits (1992)
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