Search Results1-20 of  70

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  • Fukuoka Yoshitaka ID: 9000009065842

    Articles in CiNii:1

    • Wild Life Management and Ecology:A Case Study of Bandipure National Park in Karnataka(India) (1985)
  • Fukuoka Yoshitaka ID: 9000010343221

    Articles in CiNii:1

    • Three dimensional wind simulation method reflecting topographic features (2005)
  • FUKUOKA Yoshitaka ID: 9000001404134

    P. C. B. & Module Div., Semiconductor Group, Toshiba Corporation (1996 from CiNii)

    Articles in CiNii:1

    • New High Density Printed Wiring Board Technology Named B^2it (1996)
  • FUKUOKA Yoshitaka ID: 9000002402120

    Articles in CiNii:1

    • Climatological Study on Phenological Front of Cherry-Blossoms and Its Significance as a Geograhic Education (1986)
  • FUKUOKA Yoshitaka ID: 9000002843571

    有限会社ウェイスティー (2011 from CiNii)

    Articles in CiNii:31

    • An Activity Report of the Investigation Committee on Packaging Technology of Compact & High-performance Circuits in the IEE of Japan (2003)
    • Evaluation of the high frequency transmission properties of fine-wiring pacaging substrates based on the 3D elecromagnetic simulation (2003)
    • Embedded Passive and Active Devices Technologies (2010)
  • FUKUOKA Yoshitaka ID: 9000003735088

    PWB & Module Division, Semiconductor Group, Toshiba Corporation (1998 from CiNii)

    Articles in CiNii:4

    • Thermal Management Estimations for B^2it^<TM>)Printed Wiring Boards with Bump(Filled Via Hole)Interconnection (1998)
    • Erectrical property estimations for B^2it^<TM> printed wiring boards with bump (filled-via) interconnection layers (1997)
    • Development of New Density Package Cooling Technology Using Phase-Changing Material : Application of Thermal Network Method to Phase-Changing Phenomena (1994)
  • FUKUOKA Yoshitaka ID: 9000004557751

    Environment Science, Faculty of Integrated Arts and Sciences, Hiroshima Univ. (1980 from CiNii)

    Articles in CiNii:1

    • Urban Climate and Quality of Hiroshima City : (2nd Report) (1980)
  • FUKUOKA Yoshitaka ID: 9000021439542

    Articles in CiNii:1

    • Transient Temperature Rise in Multi-chip Packages (1986)
  • FUKUOKA Yoshitaka ID: 9000255716249

    Semiconductor Group, Toshiba Corporation (1994 from CiNii)

    Articles in CiNii:1

    • Special Articles: Recent Trends on MCM and Bare LSI Chip Mounting. Recent Electronic Equipment Using MCM and Bare Chip Mounting. MCM Technology Development Trends for Engineering Work Station(EWS)/Server Machine. (1994)
  • FUKUOKA Yoshitaka ID: 9000256071891

    Hybrid IC Engineering Dept., Printed Circuit Board & Module Div., Toshiba Co., Ltd. (1988 from CiNii)

    Articles in CiNii:1

    • The new hybrid technology trend. (1988)
  • FUKUOKA Yoshitaka ID: 9000256073032

    Weisti (Worldwide Electronic Integrated Substrate Technology Inc.) (2007 from CiNii)

    Articles in CiNii:1

    • Development of Embedded Passive Substrate with Silicon Through Interconnection (2007)
  • FUKUOKA Yoshitaka ID: 9000256073206

    Worldwide Electronic Integrated Substrate Technology Inc. (2008 from CiNii)

    Articles in CiNii:1

    • Development and Commercialization of Embedded Passive and Active Devices Technology (2008)
  • FUKUOKA Yoshitaka ID: 9000256073383

    Printed Circuit Board & Module Engineering Dept., Printed Circuit Board & Module Division, Toshiba Corporation Semiconductor Company (1999 from CiNii)

    Articles in CiNii:1

    • Present and Future of Build-up PWB's-Their Possibility and Limitation. Buried Bump Interconnection Technology Printed Circuit Board. (1999)
  • FUKUOKA Yoshitaka ID: 9000256073544

    Printed Circuit Board & Module Engineering Department, Printed Circuit Board & Module Division, Semiconductor Company, Toshiba Corporation (2000 from CiNii)

    Articles in CiNii:1

    • High Density Build-up Printed Wiring Boards by the Combined Technology between Thick and Thin Film (2000)
  • FUKUOKA Yoshitaka ID: 9000256073769

    D.T. Circuit Technology Co., Ltd. (2001 from CiNii)

    Articles in CiNii:1

    • New Flip Chip Attach Technology in Which Bumps Are Formed on the Substrate (2001)
  • FUKUOKA Yoshitaka ID: 9000256074118

    Worldwide Electronic Integrated Substrate Technology Inc. (2002 from CiNii)

    Articles in CiNii:1

    • Development of Build-up Substrate “B<SUP>2</SUP>it<SUP>TM</SUP>” (Buried Bump Interconnection Technology) with Embedded Passives (2002)
  • FUKUOKA Yoshitaka ID: 9000256223896

    Articles in CiNii:1

    • Transient temperature rise for multi-chip packages. (1986)
  • FUKUOKA Yoshitaka ID: 9000323292336

    Articles in CiNii:1

    • The database of climatic disasters from A.D.601 to A.D.1200 (2015)
  • FUKUOKA Yoshitaka ID: 9000323292338

    Articles in CiNii:1

    • Secular Change and Regional Features of Climatic Disasters during 7th -12th centuries (2015)
  • FUKUOKA Yoshitaka ID: 9000391693953

    Faculty of Integrated Arts and Sciences, Hiroshima University. (1993 from CiNii)

    Articles in CiNii:1

    • The “Raison d'être” of Climatology in Geography (1993)
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