Search Results1-20 of  39

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  • Fukuoka Yoshitaka ID: 9000009065842

    Articles in CiNii:1

    • Wild Life Management and Ecology:A Case Study of Bandipure National Park in Karnataka(India) （1985）
  • Fukuoka Yoshitaka ID: 9000010343221

    Articles in CiNii:1

    • Three dimensional wind simulation method reflecting topographic features （2005）
  • FUKUOKA Yoshitaka ID: 9000001404134

    P. C. B. & Module Div., Semiconductor Group, Toshiba Corporation （1996 from CiNii）

    Articles in CiNii:1

    • New High Density Printed Wiring Board Technology Named B^2it （1996）
  • FUKUOKA Yoshitaka ID: 9000002843571

    有限会社ウェイスティー （2011 from CiNii）

    Articles in CiNii:31

    • An Activity Report of the Investigation Committee on Packaging Technology of Compact & High-performance Circuits in the IEE of Japan （2003）
    • Evaluation of the high frequency transmission properties of fine-wiring pacaging substrates based on the 3D elecromagnetic simulation （2003）
    • Embedded Passive and Active Devices Technologies （2010）
  • FUKUOKA Yoshitaka ID: 9000003735088

    PWB & Module Division, Semiconductor Group, Toshiba Corporation （1998 from CiNii）

    Articles in CiNii:4

    • Thermal Management Estimations for B^2it^<TM>)Printed Wiring Boards with Bump(Filled Via Hole)Interconnection （1998）
    • Erectrical property estimations for B^2it^<TM> printed wiring boards with bump (filled-via) interconnection layers （1997）
    • Development of New Density Package Cooling Technology Using Phase-Changing Material : Application of Thermal Network Method to Phase-Changing Phenomena （1994）
  • FUKUOKA Yoshitaka ID: 9000004557751

    Environment Science, Faculty of Integrated Arts and Sciences, Hiroshima Univ. （1980 from CiNii）

    Articles in CiNii:1

    • Urban Climate and Quality of Hiroshima City : (2nd Report) （1980）
  • FUKUOKA Yoshitaka ID: 9000021439542

    Articles in CiNii:1

    • Transient Temperature Rise in Multi-chip Packages （1986）
  • FUKUOKA Yoshitaka ID: 9000255716249

    Semiconductor Group, Toshiba Corporation （1994 from CiNii）

    Articles in CiNii:1

    • Special Articles: Recent Trends on MCM and Bare LSI Chip Mounting. Recent Electronic Equipment Using MCM and Bare Chip Mounting. MCM Technology Development Trends for Engineering Work Station(EWS)/Server Machine. （1994）
  • FUKUOKA Yoshitaka ID: 9000256071891

    Hybrid IC Engineering Dept., Printed Circuit Board & Module Div., Toshiba Co., Ltd. （1988 from CiNii）

    Articles in CiNii:1

    • The new hybrid technology trend. （1988）
  • FUKUOKA Yoshitaka ID: 9000256073032

    Weisti (Worldwide Electronic Integrated Substrate Technology Inc.) （2007 from CiNii）

    Articles in CiNii:1

    • Development of Embedded Passive Substrate with Silicon Through Interconnection （2007）
  • FUKUOKA Yoshitaka ID: 9000256073206

    Worldwide Electronic Integrated Substrate Technology Inc. （2008 from CiNii）

    Articles in CiNii:1

    • Development and Commercialization of Embedded Passive and Active Devices Technology （2008）
  • FUKUOKA Yoshitaka ID: 9000256073383

    Printed Circuit Board & Module Engineering Dept., Printed Circuit Board & Module Division, Toshiba Corporation Semiconductor Company （1999 from CiNii）

    Articles in CiNii:1

    • Present and Future of Build-up PWB's-Their Possibility and Limitation. Buried Bump Interconnection Technology Printed Circuit Board. （1999）
  • FUKUOKA Yoshitaka ID: 9000256073544

    Printed Circuit Board & Module Engineering Department, Printed Circuit Board & Module Division, Semiconductor Company, Toshiba Corporation （2000 from CiNii）

    Articles in CiNii:1

    • High Density Build-up Printed Wiring Boards by the Combined Technology between Thick and Thin Film （2000）
  • FUKUOKA Yoshitaka ID: 9000256073769

    D.T. Circuit Technology Co., Ltd. （2001 from CiNii）

    Articles in CiNii:1

    • New Flip Chip Attach Technology in Which Bumps Are Formed on the Substrate （2001）
  • FUKUOKA Yoshitaka ID: 9000256074118

    Worldwide Electronic Integrated Substrate Technology Inc. （2002 from CiNii）

    Articles in CiNii:1

    • Development of Build-up Substrate “B<SUP>2</SUP>it<SUP>TM</SUP>” (Buried Bump Interconnection Technology) with Embedded Passives （2002）
  • FUKUOKA Yoshitaka ID: 9000256223896

    Articles in CiNii:1

    • Transient temperature rise for multi-chip packages. （1986）
  • FUKUOKA Yoshitaka ID: 9000323292336

    Articles in CiNii:1

    • The database of climatic disasters from A.D.601 to A.D.1200 （2015）
  • FUKUOKA Yoshitaka ID: 9000323292338

    Articles in CiNii:1

    • Secular Change and Regional Features of Climatic Disasters during 7th -12th centuries （2015）
  • Fukuoka Yoshitaka ID: 1000000007361

    Emeritus Professor of Hiroshima and Rissho University （2019 from CiNii）

    Articles in CiNii:318

    • 中国の環境問題とエネルギー事情-酸性雨の長距離輸送- （1998）
    • Relationship between Distribution of Gaseous Pollutants and Vital Degree of Pine and Broad-leaved Tree Species on the Mt. Gokurakuji, Hiroshima Prefecture, Japan （1997）
    • 一雨降水の「前日」天気図型と酸性度(pH値)の関係について （1996）
  • Fukuoka Yoshitaka ID: 9000002219518

    Articles in CiNii:1

    • Injury of roadside trees due to deicing chemicals in relation to meteorological conditions （1991）
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