Search Results1-20 of  27

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  • HAGA Masaki ID: 9000000012686

    ISHIHARA Chemical Co., Ltd. (1996 from CiNii)

    Articles in CiNii:8

    • Effect of Inclusion on Room Temperature Softening of Copper Film Electrodeposited from Ethylenediamine Complex Bath (1995)
    • Formation of Yttrium Oxide Composite Films by Electrodeposition in Organic Solutions (1995)
    • Crystal Structure of Electroless Palladium Plating Films Using Trimethylamine Borane as a Reducing Agent (1996)
  • HAGA Masaki ID: 9000021202012

    ISHIHARA Chemical Co., Ltd. (1993 from CiNii)

    Articles in CiNii:1

    • Mass Balance and Deposition Mechanism in Electroless Pd-P Alloy Plating from a Ethylenediamine Complex Bath Using Hypophosphite as a Reducing Agent. (1993)
  • HAGA Masaki ID: 9000021224504

    ISHIHARA Chemical Co., Ltd. (1994 from CiNii)

    Articles in CiNii:1

    • Crystal Structure and Properties of Electrodeposited Palladium-Nickel-Phosphorus Alloy. (1994)
  • HAGA Masaki ID: 9000021251620

    Ishihara Chemical Co., Ltd. (1994 from CiNii)

    Articles in CiNii:1

    • Monitoring of the Composition of Electroless Palladium-Phosphorus Alloy Plating Baths by FTIR ATR Spectrometry. (1994)
  • HAGA Masaki ID: 9000021252332

    ISHIHARA Chemical Co., Ltd. (1993 from CiNii)

    Articles in CiNii:1

    • Room Temperature Softening of Copper Film Electrodeposited from Ethylenediamine Complex Bath. (1993)
  • HAGA Masaki ID: 9000021254000

    Ishihara Chemical Co, Ltd (1991 from CiNii)

    Articles in CiNii:1

    • Solderability and contact resistance of chemically deposited Pd-P alloys. (1991)
  • HAGA Masaki ID: 9000021254400

    Ishihara Chemical Co., Ltd. (1991 from CiNii)

    Articles in CiNii:1

    • Electrodeposition of Dy-Fe in organic electrolytes. (1991)
  • HAGA Masaki ID: 9000021280747

    ISHIHARA Chemical Co., Ltd. (1992 from CiNii)

    Articles in CiNii:1

    • Electrodeposition of Copper from Ethylenediamine Complex Solution and Properties of Deposit. (1992)
  • HAGA Masaki ID: 9000021309053

    ISHIHARA Chemical Co., Ltd. (1994 from CiNii)

    Articles in CiNii:1

    • Polarization Characteristics in Electroless Palladium-Phosphorus Alloy Plating Baths. (1994)
  • HAGA Masaki ID: 9000021311120

    Ishihara Chemical Co., Ltd. (1992 from CiNii)

    Articles in CiNii:1

    • Studies on Electrodeposition of Dy-Fe in Organic Electrolyte Solution. (1992)
  • HAGA Masaki ID: 9000021311711

    ISHIHARA Chemical Co., Ltd. (1991 from CiNii)

    Articles in CiNii:1

    • Electroless Pd-P Alloy Plating Using Phosphite as a Reducing Agent and Mechanism of its Autocatalytic Reduction. (1991)
  • HAGA Masaki ID: 9000021355599

    ISHIHARA Chemical Co., Ltd. (1993 from CiNii)

    Articles in CiNii:1

    • Solderability and Electric Contact Resistance of Chemically Deposited Pd-P Alloy Using Phosphite as Reducing Agent. (1993)
  • HAGA Masaki ID: 9000021357119

    Ishihara Chemical Co., Ltd (1991 from CiNii)

    Articles in CiNii:1

    • Electrodeposition of yttrium in organic electrolyte. (1991)
  • HAGA Masaki ID: 9000021375292

    Ishihara Chemical Co., Ltd. (1993 from CiNii)

    Articles in CiNii:1

    • Formation of Y2O3 and Y2O3:Eu(III) by Electrodeposition in Organic Electrolyte. (1993)
  • HAGA Masaki ID: 9000021377629

    ISHIHARA Chemical Co., Ltd. (1990 from CiNii)

    Articles in CiNii:1

    • Electrodeposition of copper from EDTA complex solution and properties of the deposit. (1990)
  • HAGA Masaki ID: 9000021950075

    ISHIHARA Chemical Co., Ltd. (1991 from CiNii)

    Articles in CiNii:1

    • Adhesion of rubber to metals and its alloy, Part 2. Cure-adhesion of rubbers to electroless Pd-P alloy deposit. Effect of sulfur and water resistance.:EFFECT OF SULFUR AND WATER RESISTANCE (1991)
  • HAGA Masaki ID: 9000021950977

    ISHIHARA Chemical Co., Ltd. (1990 from CiNii)

    Articles in CiNii:1

    • Adhesion of rubbers to metals and its alloy. Part 1. Cure-adhesion of rubbers to electroless Pd-P alloy deposit. (1990)
  • HAGA Masaki ID: 9000022037029

    ISHIHARA Chemical Co., Ltd. (1989 from CiNii)

    Articles in CiNii:1

    • Electroless plating of Pd-P alloys from ethylenediamine complex solutions. (1989)
  • HAGA Masaki ID: 9000022041116

    ISHIHARA Chemical Co., Ltd. (1989 from CiNii)

    Articles in CiNii:1

    • Electroless Pd-Ni-P alloy plating and properties of the deposit. (1989)
  • HAGA Masaki ID: 9000254333102

    Ishihara Chemicals Co., Ltd. (1976 from CiNii)

    Articles in CiNii:1

    • Testing Methods and Evaluation Standard of Solderability (1976)
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