Search Results1-20 of  224

  • HONMA Hideo ID: 9000275823823

    Articles in CiNii:1

    • Three Dimensional Nanometer/Micrometer Scale Bridge Construction Using Two-tone Photopatterning of Thin Niobium Complex Films (2014)
  • HONMA Hideo ID: 9000336049594

    Articles in CiNii:1

    • Low Aspect Ratio Through-hole Filling by Copper Electroplating (2016)
  • Honma Hideo ID: 9000338428135

    Articles in CiNii:1

    • High Resolution Metal Pattern Formation Via Photoreactive Metal Oxide Nano-anchor Agents and Nano Scale UV Photoetching (2014)
  • HONMA Hideo ID: 9000340949385

    Articles in CiNii:1

    • Formation of Conductive Layer on UV Modified PDMS (Poly-dimethyl-Siloxane) By Electroless Plating (2016)
  • HONMA Hideo ID: 9000378658754

    Articles in CiNii:1

    • Integral Formation of Circuit and Bump by Plating Process without Chemical Mechanical Polishing (CMP) (2017)
  • HONMA Hideo ID: 9000388451394

    Articles in CiNii:1

    • Direct Pattern Formation by Electroless Anisotropic Growth Copper Plating on Liquid Crystal Polymer Using Selective UV Irradiation (特集 超高温材料の開発展望) (2018)
  • Honma Hideo ID: 9000403045534

    Articles in CiNii:1

    • Effects of hydrophilic and hydrophobic surface modifications on poly(methyl methacrylate) denture base resins (2019)
  • HONMA Hideo ID: 1000000064105

    Graduate school, Kanto Gakuin University (2012 from CiNii)

    Articles in CiNii:159

    • Treatment of COD Bearing Electroless Plating Solution by UV Irradiation (1995)
    • Microbump Formation Using Electroplating or Electroless Plating (1995)
    • Fabrication of Microbump on Aluminum by Electroless Nickel Plating (1995)
  • HONMA Hideo ID: 9000000553262

    Department of Industrial Chemistry, Faculty of Engineering, kanto Gakuin University (2001 from CiNii)

    Articles in CiNii:1

    • ULSI Wiring Formation by Copper Electroplating in the Presence of Additives (2001)
  • HONMA Hideo ID: 9000001821914

    Graduate School of Engineering, Kanto Gakuin University (2006 from CiNii)

    Articles in CiNii:1

    • Electroless Nickel Plating under Continuous Ultrasonic Irradiation to Fabricate a Near-Field Probe Whose Metal Coat Decreases in Thickness toward the Tip (2006)
  • HONMA Hideo ID: 9000001995162

    Kanto Gakuin University Surface Engineering Research Institute (2007 from CiNii)

    Articles in CiNii:1

    • Effects of α,ω-Diphenylazophenoxy Polyethylene Glycol on Copper Deposition (2007)
  • HONMA Hideo ID: 9000002011253

    Kanto Gakuin University Surface Engineering Research Institute (2007 from CiNii)

    Articles in CiNii:1

    • Direct Electroless Copper Plating on Glass (2007)
  • HONMA Hideo ID: 9000002037806

    Faculty of Engineering, Kanto Gakuin University (2008 from CiNii)

    Articles in CiNii:1

    • Surface Modification of Polyimide Using UV Light and Formation of Circuit Patterns (2008)
  • HONMA Hideo ID: 9000005756524

    Faculty of Engineering, Kanto Gakuin University (1989 from CiNii)

    Articles in CiNii:1

    • Properties of PLZT Shutter with Copper Plating Electrodes : O: OPTOELECTRONICS (1989)
  • HONMA Hideo ID: 9000006616918

    Department of Applied Material and Life Science, Faculty of Engineering, Kanto Gakuin University (2008 from CiNii)

    Articles in CiNii:2

    • Pretreatment of Nickel Plating on ASA Resin Using Ozonated Water as Replacement for Chromic Acid Etching (2006)
    • Effects of Ni-P Substrate Structure and Pd/Au Film Thicknesses on the Wire Bonding Strength of Electroless Au/Pd/Ni-P Films (2008)
  • HONMA Hideo ID: 9000018828706

    月島機械株式会社 (2004 from CiNii)

    Articles in CiNii:1

    • A Study on Application of H Infinity Control Theory to an Electric-control Variable Displacement Pump (2004)
  • HONMA Hideo ID: 9000020933653

    Faculty of Engineering, Kanto Gakuin University|Material Surface Engineering Research Center, Kanto Gakuin University (2012 from CiNii)

    Articles in CiNii:1

    • Application of Electrodeposited Ni-P Film for the Improvement of Corrosion Resistance in Au-Co/Ni Processes (2012)
  • HONMA Hideo ID: 9000021022787

    Ajinomoto Co., Ltd. (1963 from CiNii)

    Articles in CiNii:1

    • Studies on the Basic Amino Acid of the Soy Sauces and the Seasoning Liquids. Part II:The Quantitative Changes of L-Arginine in the Process of Soy Sauces Brewing (1963)
  • HONMA Hideo ID: 9000021202399

    Fac. of Eng., Kanto Gakuin Univ. (1993 from CiNii)

    Articles in CiNii:1

    • Effects of Continuous Precision Filtration for Electroless Copper Plating. (1993)
  • HONMA Hideo ID: 9000021225472

    Fac. of Eng., Kanto Gakuin Univ. (1993 from CiNii)

    Articles in CiNii:1

    • Adhesion of Electroless Nickel Plating on Glass. (1993)
Page Top