Search Results1-20 of  23

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  • JUNG Jae Pil ID: 9000000097452

    Department of Material Science & Engineering, The University of Seoul (2001 from CiNii)

    Articles in CiNii:4

    • Liquid Phase Diffusion Bonding of Rene80 Using Pure Boron (1996)
    • Transient Liquid Phase Process in Ni-B Joining (1997)
    • Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis (2001)
  • JUNG Jae Pil ID: 9000001260855

    Department of Materials Science and Engineering University of Seoul (2004 from CiNii)

    Articles in CiNii:1

    • Effect of Plasma Cleaning on Fluxless Plasma Soldering of Pb-free Solder Balls on Si-wafer (2004)
  • JUNG Jae Pil ID: 9000005060339

    Corea Institute of Machinery and Metals:(Present address) Seoul City University, Department of Materials Science and Engineering (2000 from CiNii)

    Articles in CiNii:9

    • Interaction between Ca and Superficial Oxide Film in Diffusion Bonding of Al-Ca Alloys by Transmission Electron Microscopy (1996)
    • Al-X 2元系合金(X=Mg,Si,Mn,Zn,Cu)の接合界面の形成相--透過電子顕微鏡観察によるAl合金の拡散接合機構の検討(第5報) (1998)
    • Interfacial Phases in Diffusion-Bonded Joints of Al-X Alloys (X=Mg, Si, Mn, Zn, Cu) -Diffusion-Bonding Mechanism of Al Alloys by Transmission Electron Microscopy (Report 5)- (1997)
  • JUNG Jae Pil ID: 9000019144425

    Department of Materials Science and Engineering, University of Seoul (2012 from CiNii)

    Articles in CiNii:1

    • Reflection Characteristics of Displacement Deposited Sn for LED Lead Frame (2012)
  • JUNG Jae Pil ID: 9000259335599

    Department of Surgery, Kangnam Sacred Heart Hospital, Hallym Medical Center (2013 from CiNii)

    Articles in CiNii:1

    • Outcome of transilluminated powered phlebectomy for varicose vein : review of 299 patients (447 limbs) (2013)
  • JUNG Jae-Pil ID: 9000001674982

    Department of Materials Science and Engineering, University of Seoul (2005 from CiNii)

    Articles in CiNii:1

    • Reliability of Sn-8mass%Zn-3mass%Bi Lead-Free Solder and Zn Behavior (2005)
  • JUNG Jae-Pil ID: 9000001675011

    Dept. of Materials Science and Engineering, University of Seoul (2005 from CiNii)

    Articles in CiNii:1

    • Flip Chip Bump Formation of Sn-1.8Bi-0.8Cu-0.6In Solder by Stencil Printing (2005)
  • JUNG Jae-Pil ID: 9000006607497

    Department of Materials Science & Engineering, University of Seoul (2002 from CiNii)

    Articles in CiNii:7

    • Fluxless Wetting Properties of the UBM-Coated Si-Wafer to Pb-Free Solders under Different Atmosphere (2001)
    • A Study on the Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5 mass%Ag and Sn-37 mass%Pb Solder (2001)
    • Fluxless Wetting Properties of Top Surface Metallurgy in Different Pb-Free Solders (2001)
  • JUNG Jae-Pil ID: 9000261044678

    The University of Seoul (2013 from CiNii)

    Articles in CiNii:1

    • Special Issue on Nanojoining and Microjoining (2013)
  • Jung Jae Pil ID: 9000253251113

    Department of Material Science and Engineering, Seoul City University (1996 from CiNii)

    Articles in CiNii:1

    • Liquid Phase Diffusion Bonding of Rene80 Using Pure Boron (1996)
  • Jung Jae Pil ID: 9000257842934

    Department of Materials Science and Engineering University of Seoul (2004 from CiNii)

    Articles in CiNii:1

    • Effect of Plasma Cleaning on Fluxless Plasma Soldering of Pb-free Solder Balls on Si-wafer (2004)
  • Jung Jae Pil ID: 9000283290762

    Department of Materials Science and Engineering, University of Seoul (2012 from CiNii)

    Articles in CiNii:1

    • Reflection Characteristics of Displacement Deposited Sn for LED Lead Frame (2012)
  • Jung Jae Pil ID: 9000311062727

    Department of Materials Science and Engineering, University of Seoul (2015 from CiNii)

    Articles in CiNii:1

    • Lower Protrusion of a Copper-Nickel Alloy in a Through-Silicon via and Its Numerical Simulation (2015)
  • Jung Jae-Pil ID: 9000080016678

    Articles in CiNii:1

    • Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards (2008)
  • Jung Jae-Pil ID: 9000257838781

    Department of Materials Science and Engineering, University of Seoul (2001 from CiNii)

    Articles in CiNii:1

    • Fluxless Wetting Properties of the UBM-Coated Si-Wafer to Pb-Free Solders under Different Atmosphere (2001)
  • Jung Jae-Pil ID: 9000257839187

    School of Materials Science and Engineering, Seoul National University (2001 from CiNii)

    Articles in CiNii:1

    • Fluxless Wetting Properties of Top Surface Metallurgy in Different Pb-Free Solders (2001)
  • Jung Jae-Pil ID: 9000257843569

    Dept. of Materials Science and Engineering, University of Seoul (2005 from CiNii)

    Articles in CiNii:1

    • Flip Chip Bump Formation of Sn–1.8Bi–0.8Cu–0.6In Solder by Stencil Printing (2005)
  • Jung Jae-Pil ID: 9000257843594

    Department of Materials Science and Engineering, University of Seoul (2005 from CiNii)

    Articles in CiNii:1

    • Reliability of Sn–8 mass%Zn–3 mass%Bi Lead-Free Solder and Zn Behavior (2005)
  • Jung Jae-Pil ID: 9000296661962

    University of Seoul (2015 from CiNii)

    Articles in CiNii:1

    • PREFACE (2015)
  • Jung Jae Pil ID: 9000006119459

    University of Ulsan College of Medicine and Asan Medical Center (2006 from CiNii)

    Articles in CiNii:1

    • Ex situ split liver transplantation for two adult recipients (2006)
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