Search Results1-20 of  35

  • 1 / 2
  • KAWAI Sueo ID: 9000003644224

    Mechanical Engineering Research Laboratory, Hitachi, Ltd. （1994 from CiNii）

    Articles in CiNii:7

    • Development of A System for Evaluating IC Plastic Package Damage Occurring During Reflow Soldering （1994）
    • A Simple Analysis Method of Thermal Resistance of Plastic IC Packages （1991）
    • Effects of Ground and Peened on Fatigue Strength of Welded Joint under High Mean Stresses （1975）
  • KAWAI Sueo ID: 9000003711973

    日立工機(株) （2004 from CiNii）

    Articles in CiNii:8

    • J-Integral Equation of 3-D Surface Crack under Bending Loads at Elevated Temperature for Elastic-Plastic Analyses （2003）
    • My Research Activities in Hitachi （2003）
    • 〔11〕代表的な航空機用金属の繰返し応力-ひずみと疲れの挙動〔T. Endo & J. Morrow, J. Materials, 1969-3,Vol. 4,No. 1,p. 159〜175,図11,表6〕 （1970）
  • KAWAI Sueo ID: 9000020028808

    Articles in CiNii:1

    • Consideration about allowable stress of corrosion fatigue. （1985）
  • KAWAI Sueo ID: 9000020094769

    Articles in CiNii:1

    • Development and application of the stress sensing test chip for IC plastic packages. （1987）
  • KAWAI Sueo ID: 9000020126027

    Articles in CiNii:1

    • The Influences of Mean Stresses and Stress History on Fatigue Crack Growth Behavior （1977）
  • KAWAI Sueo ID: 9000020143091

    Articles in CiNii:1

    • Structural Design of Electronic Devices. （1993）
  • KAWAI Sueo ID: 9000020166652

    Articles in CiNii:1

    • Effects of Stress Waveforms and Frequencies on Fatigue Crack Growth in 3% NaCl Solution （1978）
  • KAWAI Sueo ID: 9000020252461

    Articles in CiNii:1

    • Thermal fatigue strength estimation of solder joints of surface mount IC packages. （1988）
  • KAWAI Sueo ID: 9000020260974

    Articles in CiNii:1

    • Torsional Fatigue Strength of Shrink Fitted Shaft （1981）
  • KAWAI Sueo ID: 9000020294352

    Articles in CiNii:1

    • Effect of Stress Ratio on Fatigue Crack Growth in Low ΔK Regime in 3% NaCl Solution （1981）
  • KAWAI Sueo ID: 9000020496133

    Articles in CiNii:1

    • Thermal Stress in Silicon Chips Encapsulated in IC Plastic Packages under Temperature Cycling. （1991）
  • KAWAI Sueo ID: 9000020498282

    Articles in CiNii:1

    • Residual stress in resin-molded IC chips. （1989）
  • KAWAI Sueo ID: 9000020552467

    Articles in CiNii:1

    • Fatigue Test of an Actual Car Body Structure. 1st Report. The Testing Method and Its Accuracy. （1992）
  • KAWAI Sueo ID: 9000020574763

    Articles in CiNii:1

    • Thermal Stress in Silicon Chips Encapsulated in IC Plastic Packages. （1991）
  • KAWAI Sueo ID: 9000020589276

    Articles in CiNii:1

    • A Study of Package Cracking during the Reflow Soldering Process. 2nd Report. Strength Evaluation of the Plastic by Using Stress Singularity Theory. （1991）
  • KAWAI Sueo ID: 9000020590286

    Articles in CiNii:1

    • Effect of package structure on the residual stress of silicon chips encapsulated in IC plastic packages. （1990）
  • KAWAI Sueo ID: 9000020590915

    Articles in CiNii:1

    • A study of package cracking during the reflow soldering process. （1989）
  • KAWAI Sueo ID: 9000020771404

    Articles in CiNii:1

    • Stress Analysis of Structures with Cyclic Deformation Mode Using Finite Element Method with Three-Dimensional Curved Elements : 2nd Report, Nonlinear Analysis （1981）
  • KAWAI Sueo ID: 9000021123365

    Articles in CiNii:1

    • Fracture properties of highly silica particulate filled epoxide resins. （1989）
  • 1 / 2
Page Top