Search Results1-11 of  11

  • KIMIZUKA Ryoichi ID: 9000004969685

    R & D Headquarters Ebara-Udylite Co., Ltd. (2001 from CiNii)

    Articles in CiNii:2

    • Acid Copper Plating Technology for Electronics (Electro Device) Field (2001)
    • Two-step Copper Electroplating Technique using Seed Enhancement step (2001)
  • KIMIZUKA Ryoichi ID: 9000006072367

    荏原ユージライト(株)総合研究所 (2011 from CiNii)

    Articles in CiNii:4

    • ビアフィリング銅めっき技術 (2011)
    • Technology of Copper Via Filling (2011)
    • Characteristic Evaluations of Copper Crystal in Deposited Films by Acid Copper Plating for Via Filling (2006)
  • KIMIZUKA Ryoichi ID: 9000254968612

    Ebara-Udylite Co., Ltd. (1988 from CiNii)

    Articles in CiNii:1

    • Blackening zinc-nickel alloy plating and corrosion/heat resist effects. (1988)
  • KIMIZUKA Ryoichi ID: 9000256074673

    Research and Development Center, EBARA-UDYLITE CO., LTD (2006 from CiNii)

    Articles in CiNii:1

    • Characteristic Evaluations of Copper Crystal in Deposited Films by Acid Copper Plating for Via Filling (2006)
  • Kimizuka Ryoichi ID: 9000258391350

    EU (2006 from CiNii)

    Articles in CiNii:1

    • Acid Copper Plating for Via Filling in the Use of Insoluble Anode (2006)
  • Kimizuka Ryoichi ID: 9000258391893

    EBARA-UDYLITE CO.,LTD. (2003 from CiNii)

    Articles in CiNii:1

    • Bright Acid Copper Technology for Via Filling (2003)
  • Kimizuka Ryoichi ID: 9000265536499

    Research & Development Center, JCU Corporation (2014 from CiNii)

    Articles in CiNii:1

    • Study of New Removal Technique by Use of Magnetic Polishing Method for Copper Overhang Generated in the Direct Laser Via Process (2014)
  • Kimizuka Ryoichi ID: 9000265536506

    前理事,前総務副委員長|株式会社JCU 代表取締役社長兼COO (2014 from CiNii)

    Articles in CiNii:1

    • Mission Fellow System for the Future (2014)
  • Kimizuka Ryoichi ID: 9000283739829

    EBARA UDYLITE (2007 from CiNii)

    Articles in CiNii:1

    • Technology of acid copper plating for through hole filling. (2007)
  • Kimizuka Ryoichi ID: 9000391796271

    EBARA-UDYLITE CO., LTD. (2002 from CiNii)

    Articles in CiNii:1

    • Application of Acid Copper Plating Solution for Via Filling (2002)
  • Ryoichi Kimizuka ID: 9000397689235

    Research & Development Center, JCU Corporation. (2014 from CiNii)

    Articles in CiNii:1

    • Study of New Removal Technique by Use of Magnetic Polishing Method of Copper Overhang Generated in the Direct Laser Via Process (2014)
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