Search Results1-8 of  8

  • KIYOTA Tetsuji ID: 9000000033333

    ULVAC Japan Ltd. (1998 from CiNii)

    Articles in CiNii:2

    • Reflow Characteristics of Cu Film Sputtered on the Various Under Layer Material (1998)
    • Aluminum Films Deposition Using a UHV Sputtering System with an Ultimate Pressure of the Order of 10^<-8)Pa. (1992)
  • KIYOTA Tetsuji ID: 9000000059543

    ULVAC Japan Ltd. (1998 from CiNii)

    Articles in CiNii:1

    • Effects of the Gasses in Sputtering Processes (1998)
  • KIYOTA Tetsuji ID: 9000019955075

    ULVAC CORP. (1985 from CiNii)

    Articles in CiNii:1

    • All aluminum alloy sputter equipment of small scale. (1985)
  • KIYOTA Tetsuji ID: 9000021512062

    ULVAC Japan Ltd. (1991 from CiNii)

    Articles in CiNii:1

    • The 100MHz RF-DC coupled bias UHV sputtering system and Al films depostion. (1991)
  • Kiyota Tetsuji ID: 9000014649654

    電気通信大学・物理工学科 (1982 from CiNii)

    Articles in CiNii:1

    • Measurement of Young's Modulus by Vibration of String (1982)
  • Kiyota Tetsuji ID: 9000252985838

    Research & Development Division, ULVAC Japan, Ltd. (1993 from CiNii)

    Articles in CiNii:1

    • Aluminum Film Deposition Using an Ultrahigh-Vacuum Sputtering System (1993)
  • Kiyota Tetsuji ID: 9000392738002

    Articles in CiNii:1

    • Aluminum Film Deposition Using an Ultrahigh-Vacuum Sputtering System (1993)
  • Kiyota Tetsuji ID: 9000401637592

    Articles in CiNii:1

    • Aluminum Film Deposition Using an Ultrahigh-Vacuum Sputtering System (1993)
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