Search Results1-20 of  120

  • KOIWA Ichiro ID: 9000324986037

    Articles in CiNii:1

    • Surface Nano-Roughness Enhanced Adhesion Strength of Electroless Nickel-Phosphorus on Silicon Nitride-Aluminum-Polyimide Mixed (2016)
  • KOIWA Ichiro ID: 9000356623705

    Articles in CiNii:1

    • Effect of Ammonium Chloride to Dimethyl Sulfone Solution on Aluminum Electrodeposition (2017)
  • KOIWA Ichiro ID: 9000361229029

    Articles in CiNii:1

    • Quaternary Ammonium Salt Additives for High TiO₂ Particle Content in Electrodeposited Zn-TiO₂ Composites (2017)
  • KOIWA Ichiro ID: 9000000279596

    Semiconductor Technology Laboratories, Oki Electric Industry Co.Ltd. (1998 from CiNii)

    Articles in CiNii:1

    • Preparation of SrBi_2Ta_2O_9(SBT)thin films by means of Sol-Gel method (1998)
  • KOIWA Ichiro ID: 9000001866426

    Department of Applied Material and Life Science, Faculty of Engineering, Kanto Gakuin University (2007 from CiNii)

    Articles in CiNii:1

    • Reduction of Process-induced Damage and Improvement of Imprint Characteristics in SrBi_2Ta_2O_9 Capacitors by Postmetallization Annealing (2007)
  • KOIWA Ichiro ID: 9000004813417

    Semiconductor Technology Laboratories, Oki Electric Industry Co., Ltd. (2000 from CiNii)

    Articles in CiNii:14

    • Effects of H_2 Sintering and Pt Upper Electrode on Metallic Bi Content in Sr_<0.9>Bi_<2.1>Ta_2O_9 Thin Films for Ferroelectric Memories Prepared by Sol-Gel Method (1998)
    • Low Voltage Operation of Ferroelectric Sr_<0.9>Bi_<2.1>Ta_2O_9 Thin Films Crystallized by Excimer Laser Annealing (1998)
    • Orientation Control of Sr_<0.7>Bi_<2.3>Ta_2O_9 Thin Films by Chemical Process (1996)
  • KOIWA Ichiro ID: 9000004817298

    The authors are with Research and Development Group, Oki Electric Industry Co., Ltd. (1998 from CiNii)

    Articles in CiNii:1

    • SrBi_2Ta_2O_9 Thin Films Fabricated by Sol-Gel Method with IrO_2 Electrodes (1998)
  • KOIWA Ichiro ID: 9000004873535

    Microsystem Technology Laboratory, Research and Development Group, Oki Electric Industry Co., Ltd. (1996 from CiNii)

    Articles in CiNii:1

    • Application of Alkaline-Earth-Metal and Rare-Earth-Element Compound-Oxide Formation Solutions to a Protective Layer for AC-type Plasma Display Panel (1996)
  • KOIWA Ichiro ID: 9000006616916

    Department of Applied Material and Life Science, Faculty of Engineering, Kanto Gakuin University (2008 from CiNii)

    Articles in CiNii:2

    • Pretreatment of Nickel Plating on ASA Resin Using Ozonated Water as Replacement for Chromic Acid Etching (2006)
    • Effects of Ni-P Substrate Structure and Pd/Au Film Thicknesses on the Wire Bonding Strength of Electroless Au/Pd/Ni-P Films (2008)
  • KOIWA Ichiro ID: 9000006731235

    Faculty of Engineering, Kanto Gakuin University (2011 from CiNii)

    Articles in CiNii:11

    • Which is More Delicious, Summer Tomato or Winter Tomato? (2006)
    • 特集「地球環境と表面処理技術」の企画に当たって (2006)
    • UNIZONE Co., Ltd. (2007)
  • KOIWA Ichiro ID: 9000021202919

    Research Laboratory, Oki Electric Industry Co. Ltd. (1991 from CiNii)

    Articles in CiNii:1

    • Effectiveness of Electroplating on A Thick Film Cathode for DC-Type Color Plasma Display Panels. (1991)
  • KOIWA Ichiro ID: 9000021357783

    沖電気工業 (株) 基盤技術研究所 (1990 from CiNii)

    Articles in CiNii:1

    • My Hope for the Surface Finishing Society of Japan (1990)
  • KOIWA Ichiro ID: 9000021948571

    Surface Engineering Research Institute, Kanto Gakuin University|Department of Applied Material and Life Science, Faculty of Engineering, Kanto Gakuin University (2006 from CiNii)

    Articles in CiNii:1

    • Advanced Plating Technology for Electronic Devices (2006)
  • KOIWA Ichiro ID: 9000022006881

    Graduate School of Engineering, Kanto Gakuin University|Kanto Gakuin University Surface Engineering Research Institute Co. Ltd. (2006 from CiNii)

    Articles in CiNii:1

    • Surface Modification of Insulation Resin for Build-up Process Using TiO<sub>2</sub> as a Photocatalyst and Its Application to the Metallization (2006)
  • KOIWA Ichiro ID: 9000022025153

    Res. Labs., Oki Electric Industry Co., Ltd. (1989 from CiNii)

    Articles in CiNii:1

    • A study on extraneous deposition of electroless Ni-W-P alloy films on transparent electrode. (1989)
  • KOIWA Ichiro ID: 9000022029789

    Faculty of Engineering, Kanto Gakuin University (2006 from CiNii)

    Articles in CiNii:1

    • Via-filling by Copper Electroplating using Stepwise Current Control (2006)
  • KOIWA Ichiro ID: 9000022032982

    Sch. of Sci. and Eng., Waseda Univ. (1989 from CiNii)

    Articles in CiNii:1

    • Metallization of alumina ceramics substrates by electroless-plated films. (1989)
  • KOIWA Ichiro ID: 9000022036934

    School of Sci, and Eng., Waseda Univ.|Present: Res. Labs., OKI Electric Ind. Co., Ltd. (1989 from CiNii)

    Articles in CiNii:1

    • Preparation and evaluation of electroless-plated Nickel-alloys for a thin film resistor. (1989)
  • KOIWA Ichiro ID: 9000022055132

    Kanto Gakuin University Surface Engineering Research Institute|Faculty of Engineering, Kanto Gakuin University (2006 from CiNii)

    Articles in CiNii:1

    • Surface Reforming of ABS Resin Using TiO2 under UV Light Irradiation (2006)
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