Search Results1-20 of  27

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  • Kumazawa Tetsuo ID: 9000010458167

    Articles in CiNii:1

    • Dynamic deformation evaluation by electromotive force ([日本実験力学会]分科会合同ワークショップ2007 実験力学における計測・データ処理の問題点・ノウハウ・工夫) (2007)
  • KUMAZAWA Tetsuo ID: 9000001380657

    秋田県立大学 (2009 from CiNii)

    Articles in CiNii:38

    • Combined Effects of Rolling and Blending with Liquid Crystalline Polyester on the Fatigue properties of Polypropylene under High Rolling Ratio (2001)
    • A Review for Present and Future of Strain Measurement Standard (2001)
    • Recent Stress and Strain Evaluation for Semiconductor Packaging (2001)
  • KUMAZAWA Tetsuo ID: 9000002886560

    (株)日立製作所 (1984 from CiNii)

    Articles in CiNii:1

    • Profile Measurement of a Concave Surface Using the Interference Fringe of Reflected Light (1984)
  • KUMAZAWA Tetsuo ID: 9000002955885

    Department of Machine Intelligence and Systems Engineering Faculty of Science and Technology, Akita Prefectural University (2001 from CiNii)

    Articles in CiNii:8

    • Fatigue Life Evaluation of Solder Ball Joints (1997)
    • Development of A System for Evaluating IC Plastic Package Damage Occurring During Reflow Soldering (1994)
    • Development of Technologies for Mounting Optical Lens in Optical Communication Modules by Plastic Deformation Method (1999)
  • KUMAZAWA Tetsuo ID: 9000003694503

    Mechanical Engineering Laboratory, Hitachi, Ltd. (1997 from CiNii)

    Articles in CiNii:6

    • Input connectors of strain measuring instrument (1994)
    • Present and Future in the Analysis of Strength Reliability (1997)
    • マイクロスペックル干渉計による面内変位測定 (1988)
  • KUMAZAWA Tetsuo ID: 9000003809095

    Department of Machine Intelligence and Systems Engineering, Akita Prefectural University (2002 from CiNii)

    Articles in CiNii:2

    • SB-06-5(036) Influence of Pre-Aging on Creep Rupture Strength of Tungsten Alloyed 9%Cr Ferritic Steel and Creep Damage Evaluation by Electrochemical Method(Changes in Microstructure 1) : (2001)
    • Influence of Pre-Aging on Creep Rupture Strength of Tungsten Alloyed 9%Cr Ferritic Steel and Creep Damage Evaluation by Electrochemical Method (2002)
  • KUMAZAWA Tetsuo ID: 9000020201513

    Articles in CiNii:1

    • Fracture Mechanism of Picture Tube for Color Television (1978)
  • KUMAZAWA Tetsuo ID: 9000022203791

    Articles in CiNii:1

    • Optical Axis Determination of Semiconductor Laser Systems. (1992)
  • KUMAZAWA Tetsuo ID: 9000253505042

    日立製作所機械研究所 (1992 from CiNii)

    Articles in CiNii:1

    • Reliability Evaluation of Electronic Devices and Visualization of it's Results. (1992)
  • KUMAZAWA Tetsuo ID: 9000254270043

    正会員 (株)日立製作所 (1984 from CiNii)

    Articles in CiNii:1

    • Profile Measurement of a Concave Surface Using the Interference Fringe of Reflected Light (1984)
  • KUMAZAWA Tetsuo ID: 9000254281734

    Mechanical Engineering Research Laboratory, Hitachi, Ltd. (1989 from CiNii)

    Articles in CiNii:1

    • Development of the Oil Filled High Pressure Sensor Using a Silicon Piezoresistive Strain Gauge (1989)
  • KUMAZAWA Tetsuo ID: 9000254935551

    Department of Machine Intelligence and Systems Engineering, Faculty of Science and Technology, Akita Prefectural University (2001 from CiNii)

    Articles in CiNii:1

    • Combined Effects of Rolling and Blending with Liquid Crystalline Polyester on the Fatigue Properties of Polypropylene under High Rolling Ratio. (2001)
  • KUMAZAWA Tetsuo ID: 9000255716800

    Department of Machine Intelligence and Systems Engineering Faculty of Science and Technology, Akita Prefectural University (2001 from CiNii)

    Articles in CiNii:1

    • Moisture Absorbency of Optical Components Resin Adhesive. (2001)
  • KUMAZAWA Tetsuo ID: 9000255719195

    秋田県立大学システム科学技術学部 (2001 from CiNii)

    Articles in CiNii:1

    • Recent Stress and Strain Evaluation for Semiconductor Packaging (2001)
  • KUMAZAWA Tetsuo ID: 9000256072727

    Mechanical Engineering Research Laboratory, Hitachi, Ltd. (1997 from CiNii)

    Articles in CiNii:1

    • Fatigue Life Evaluation of Solder Ball Joints. (1997)
  • KUMAZAWA Tetsuo ID: 9000256073330

    Department of Machine Intelligence and Systems Engineering, Faculty of Systems, Science and Technology, Akita Prefectural University (1999 from CiNii)

    Articles in CiNii:1

    • Trends of Inspection & Reliability Technologies. Mechanical Reliability of Electronics Packaging. (1999)
  • KUMAZAWA Tetsuo ID: 9000256074731

    Akita Prefectural University (2006 from CiNii)

    Articles in CiNii:1

    • Generation of Electromotive Force of Solder Wires and Solder Joints Caused by Their Deformation and Its Evaluation (2006)
  • KUMAZAWA Tetsuo ID: 9000257991895

    Department of Machine Intelligence and Systems Engineering, Faculty of Science and Technology, Akita Prefectural University (2006 from CiNii)

    Articles in CiNii:1

    • Effects of Injection-molded Conditions on the Microstructure and Mechanical Properties of PC/LCP Blends (2006)
  • KUMAZAWA Tetsuo ID: 9000313612380

    秋田県立大学システム科学技術学部 (2012 from CiNii)

    Articles in CiNii:1

    • J061022 Deformation Evaluation of Solder Joint using electromotive force method and FEM (2012)
  • KUMAZAWA Tetsuo ID: 9000397836904

    Articles in CiNii:1

    • 5-108 Educational practice of the strength of materials learned from the tensile and bending test using paper:: The lesson for the freshman in a university "the world of creation science A" (2005)
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