Search Results1-20 of  35

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  • KAWAI Sueo ID: 9000003644224

    Mechanical Engineering Research Laboratory, Hitachi, Ltd. (1994 from CiNii)

    Articles in CiNii:7

    • Development of A System for Evaluating IC Plastic Package Damage Occurring During Reflow Soldering (1994)
    • A Simple Analysis Method of Thermal Resistance of Plastic IC Packages (1991)
    • Effects of Ground and Peened on Fatigue Strength of Welded Joint under High Mean Stresses (1975)
  • KAWAI Sueo ID: 9000003711973

    日立工機(株) (2004 from CiNii)

    Articles in CiNii:8

    • J-Integral Equation of 3-D Surface Crack under Bending Loads at Elevated Temperature for Elastic-Plastic Analyses (2003)
    • My Research Activities in Hitachi (2003)
    • 〔11〕代表的な航空機用金属の繰返し応力-ひずみと疲れの挙動〔T. Endo & J. Morrow, J. Materials, 1969-3,Vol. 4,No. 1,p. 159〜175,図11,表6〕 (1970)
  • KAWAI Sueo ID: 9000020028808

    Articles in CiNii:1

    • Consideration about allowable stress of corrosion fatigue. (1985)
  • KAWAI Sueo ID: 9000020094769

    Articles in CiNii:1

    • Development and application of the stress sensing test chip for IC plastic packages. (1987)
  • KAWAI Sueo ID: 9000020126027

    Articles in CiNii:1

    • The Influences of Mean Stresses and Stress History on Fatigue Crack Growth Behavior (1977)
  • KAWAI Sueo ID: 9000020143091

    Articles in CiNii:1

    • Structural Design of Electronic Devices. (1993)
  • KAWAI Sueo ID: 9000020166652

    Articles in CiNii:1

    • Effects of Stress Waveforms and Frequencies on Fatigue Crack Growth in 3% NaCl Solution (1978)
  • KAWAI Sueo ID: 9000020252461

    Articles in CiNii:1

    • Thermal fatigue strength estimation of solder joints of surface mount IC packages. (1988)
  • KAWAI Sueo ID: 9000020260974

    Articles in CiNii:1

    • Torsional Fatigue Strength of Shrink Fitted Shaft (1981)
  • KAWAI Sueo ID: 9000020294352

    Articles in CiNii:1

    • Effect of Stress Ratio on Fatigue Crack Growth in Low ΔK Regime in 3% NaCl Solution (1981)
  • KAWAI Sueo ID: 9000020496133

    Articles in CiNii:1

    • Thermal Stress in Silicon Chips Encapsulated in IC Plastic Packages under Temperature Cycling. (1991)
  • KAWAI Sueo ID: 9000020497698

    Articles in CiNii:1

    • Thermal fatigue strength estimation of solder joints of surface mount IC packages. 2nd Report; Comparison of three types of leads. (1990)
  • KAWAI Sueo ID: 9000020498282

    Articles in CiNii:1

    • Residual stress in resin-molded IC chips. (1989)
  • KAWAI Sueo ID: 9000020552467

    Articles in CiNii:1

    • Fatigue Test of an Actual Car Body Structure. 1st Report. The Testing Method and Its Accuracy. (1992)
  • KAWAI Sueo ID: 9000020574763

    Articles in CiNii:1

    • Thermal Stress in Silicon Chips Encapsulated in IC Plastic Packages. (1991)
  • KAWAI Sueo ID: 9000020589276

    Articles in CiNii:1

    • A Study of Package Cracking during the Reflow Soldering Process. 2nd Report. Strength Evaluation of the Plastic by Using Stress Singularity Theory. (1991)
  • KAWAI Sueo ID: 9000020590286

    Articles in CiNii:1

    • Effect of package structure on the residual stress of silicon chips encapsulated in IC plastic packages. (1990)
  • KAWAI Sueo ID: 9000020590915

    Articles in CiNii:1

    • A study of package cracking during the reflow soldering process. (1989)
  • KAWAI Sueo ID: 9000020771404

    Articles in CiNii:1

    • Stress Analysis of Structures with Cyclic Deformation Mode Using Finite Element Method with Three-Dimensional Curved Elements : 2nd Report, Nonlinear Analysis (1981)
  • KAWAI Sueo ID: 9000021123365

    Articles in CiNii:1

    • Fracture properties of highly silica particulate filled epoxide resins. (1989)
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