Search Results1-20 of  28

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  • Koiwa Kozo ID: 9000241500642

    Articles in CiNii:1

    • Development of Cu/Insulation Layer Interface Crack Extension Simulation with Crystal Plasticity (Special Issue : Solid State Devices and Materials) (2013)
  • KOIWA Kozo ID: 9000006638568

    Division of Advanced Fibro Sci., Kyoto Inst. of Tech. (2006 from CiNii)

    Articles in CiNii:1

    • Electrical Properties of CNF/NiTi/UPR Three-Phase Composites (2006)
  • KOIWA Kozo ID: 9000014627439

    Kobe University (2013 from CiNii)

    Articles in CiNii:10

    • Evaluation of fracture toughness for fiber/matrix micro-debonding by using micro model composites (2007)
    • 406 Evaluation of Fracture Toughness for Fiber/Matrix Micro-Debonding by Using Micro Model Composites (2007)
    • 723 Extraction of Fiber/Matrix Micro-Debonding Fracture Toughness by Using Micro Model Composites (2008)
  • KOIWA Kozo ID: 9000021330760

    Dept. of Mech. Eng., Kobe Univ. (2012 from CiNii)

    Articles in CiNii:1

    • Measurements of Mode I Fiber/Matrix Interfacial Fracture Toughness by Using Real-Size Model Composite Specimens (2012)
  • KOIWA Kozo ID: 9000021336146

    Dept. of Mech. Eng., Kobe Univ. (2008 from CiNii)

    Articles in CiNii:1

    • Evaluation of Fiber/Matrix Interfacial Fracture Toughness and Its Contribution to Composite Toughness by Using Two and Four-Fibers Model Composite Specimens (2008)
  • KOIWA Kozo ID: 9000021444493

    Kobe Univ. Dept. of Mechanical Engineering (2011 from CiNii)

    Articles in CiNii:1

    • Evaluation of Mode I Fiber/Matrix Interfacial Fracture Toughness and Matrix Toughness in FRP by Using Real-Size Model Composites (2011)
  • KOIWA Kozo ID: 9000240086942

    Department of Mechanical Engineering, Nagoya Institute of Technology (2013 from CiNii)

    Articles in CiNii:1

    • Specimen Size Effect of Interface Strength Distribution Induced by Grain Structure of Cu Line (2013)
  • KOIWA Kozo ID: 9000242871401

    Nagoya Institute of Technology:Core Research for Evolutional Science and Technology, JST (2013 from CiNii)

    Articles in CiNii:11

    • Nano-ordered Evaluation for Local Distribution of Adhesion Strength Between Cu/Dielectric in LSI Circuit (2013)
    • 528 Development of Numerical Simulation of Elastic-Plastic Crack Extension for Evaluation of Local Interfacial Toughness in LSI Interconnects (2012)
    • 529 Trial of evaluation for the correlation between local interface strength and grain distribution on damascene interconnects (2012)
  • KOIWA Kozo ID: 9000293832158

    Nagoya Institute of Technology (2012 from CiNii)

    Articles in CiNii:1

    • 528 Development of Numerical Simulation of Elastic-Plastic Crack Extension for Evaluation of Local Interfacial Toughness in LSI Interconnects (2012)
  • KOIWA Kozo ID: 9000293832173

    Nagoya Institute of Technology, JST (2012 from CiNii)

    Articles in CiNii:1

    • 529 Trial of evaluation for the correlation between local interface strength and grain distribution on damascene interconnects (2012)
  • KOIWA Kozo ID: 9000303985010

    Nagoya Institute of Technology (2013 from CiNii)

    Articles in CiNii:6

    • J211022 Anisotropy of Cu/SiN interface toughness induced by copper crystal plasticity (2013)
    • 107 Prediction of Energy Release Rate Distribution over Cu/Insulator Interface in LSI devices by TCAD Process Simulator (2013)
    • OS1218 Evaluation of adhesion strength at a point of Cu/ insulation layer interface in LSI by crack extension simulation with Cu crystal plasticity (2013)
  • KOIWA Kozo ID: 9000304001482

    JST:名古屋工業大学 (2012 from CiNii)

    Articles in CiNii:1

    • OS1904 Evaluation of Cu line/insulation layer interface strength by means of crack extension simulation with crystal grain anisotropy (2012)
  • KOIWA Kozo ID: 9000304001490

    Nagoya Institute of Technology (2012 from CiNii)

    Articles in CiNii:1

    • OS1905 Integration of elastic-plastic properties for the development of Cu/insulation layer interface strength evaluation method (2012)
  • KOIWA Kozo ID: 9000304308632

    Nagoya Institute of Technology Dept. of Mechanical Engineering (2014 from CiNii)

    Articles in CiNii:1

    • OS1108 Development of evaluation method for copper crystal plasticity with small-scale specimens (2014)
  • KOIWA Kozo ID: 9000304691916

    JST (2014 from CiNii)

    Articles in CiNii:1

    • J2240407 Evaluation of mechanical energy required to separate Cu/SiN interface on different crystal orientations (2014)
  • KOIWA Kozo ID: 9000305590877

    Nagoya Institute of Technology (2014 from CiNii)

    Articles in CiNii:1

    • 303 Influence of local deformation at grain boundary on adhesion strength of the Cu/SiN interface in LSI interconnect (2014)
  • KOIWA Kozo ID: 9000308047574

    Nagoya Institute of Technology:JST (2013 from CiNii)

    Articles in CiNii:1

    • 535 Evaluation of the effect of copper grain structure to Cu/SiN interfacial adhesion strength in LSI using crack propagation simulation (2013)
  • KOIWA Kozo ID: 9000309160678

    Department of Mechanical Engineering, Kobe University (2011 from CiNii)

    Articles in CiNii:1

    • OS12F018 Fracture Mechanics Evaluation of Mode I and Mode II Fiber/Matrix Interfacial Crack by Using Real-Size Model Composite (2011)
  • KOIWA Kozo ID: 9000309160984

    Graduate School of Department of Mechanical Engineering, Kobe University (2011 from CiNii)

    Articles in CiNii:1

    • OS12-6-1 Fracture Mechanics Evaluation of Mode I and Mode II Fiber/Matrix Interfacial Crack by Using Real-Size Model Composite (2011)
  • KOIWA Kozo ID: 9000313611455

    名古屋工業大学, JST (2012 from CiNii)

    Articles in CiNii:1

    • J032021 Grain structure induced specimen size effect on interface strength distribution of Cu line (2012)
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