Search Results141-145 of  145

  • Kondo Seiichi ID: 9000401778186

    Articles in CiNii:1

    • Effect of Dissolved Oxygen on Cu Corrosion in Single Wafer Cleaning Process (2009)
  • Kondo Seiichi ID: 9000401788303

    Articles in CiNii:1

    • High-Etching-Selectivity Barrier SiC (k<3.5) Film for 32-nm-Node Copper/Low-kInterconnects (2010)
  • Kondo Seiichi ID: 9000401788348

    Articles in CiNii:1

    • Hybrid Electrochemical Mechanical Planarization Process for Cu Dual-Damascene Through-Silicon Via Using Noncontact Electrode Pad (2010)
  • Kondo Seiichi ID: 9000401995583

    Articles in CiNii:1

    • Fabrication of 70-nm-Pitch Two-Level Interconnects by using Extreme Ultraviolet Lithography (2011)
  • Kondo Seiichi ID: 9000402043849

    Articles in CiNii:1

    • Electrochemical study on metal corrosion in chemical mechanical planarization process (2017)
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