Search Results1-9 of  9

  • KOO Ja-Myeong ID: 9000001439266

    Dept. of Advanced Materials Engineering, Sungkyunkwan University (2005 from CiNii)

    Articles in CiNii:1

    • Induction Brazing of γ-TiAl to Alloy Steel AISI 4140 Using Filler Metal of Eutectic Ag-Cu Alloy Coated with Ti Film (2005)
  • KOO Ja-Myeong ID: 9000002046742

    School of Advanced Materials Science & Engineering, Sungkyunkwan University (2007 from CiNii)

    Articles in CiNii:1

    • Characterization of Failure Behaviors in Anisotropic Conductive Interconnection (2007)
  • Koo Ja-Myeong ID: 9000014632710

    Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng. (2008 from CiNii)

    Articles in CiNii:4

    • 2-09-03 Effect of Atmospheric Pressure Plasma Treatment on Joint Strength between Flip Chip Bump and Flexible Printed Circuit Board (FPCB) Bonded Using Ultrasonic(High power ultrasound) (2007)
    • 2-09P-48 Effect of Bonding Condition on Joint Strength between Rigid and Flexible Printed Circuit Boards(Poster session 2) (2007)
    • 1P1-11 Effect of atmospheric pressure plasma treatment on ultrasonic bumpless flip chip bonding(Poster Session) (2008)
  • Koo Ja-Myeong ID: 9000014632768

    Univ. Sungkyunkwan, Sch. of Adv. Mat. Sci. and Eng. (2007 from CiNii)

    Articles in CiNii:1

    • 2-09P-47 Thermal Reliability of Package with Underfill using Ultrasonic Bonding(Poster session 2) (2007)
  • Koo Ja-Myeong ID: 9000025084684

    Articles in CiNii:1

    • Application of underfill for flip-chip package using ultrasonic bonding (Special issue: Ultrasonic electronics) (2008)
  • Koo Ja-Myeong ID: 9000025084897

    Articles in CiNii:1

    • Longitudinal ultrasonic bonding of electrodes between rigid and flexible printed circuit boards (Special issue: Ultrasonic electronics) (2008)
  • Koo Ja-Myeong ID: 9000025085296

    Articles in CiNii:1

    • Effect of atmospheric pressure plasma treatment on transverse ultrasonic bonding of gold flip-chip bump on glass substrate (Special issue: Ultrasonic electronics) (2008)
  • Koo Ja-Myeong ID: 9000257847389

    School of Advanced Materials Science & Engineering, Sungkyunkwan University (2007 from CiNii)

    Articles in CiNii:1

    • Characterization of Failure Behaviors in Anisotropic Conductive Interconnection (2007)
  • Koo Ja-Myeong ID: 9000401781068

    Articles in CiNii:1

    • Effect of Time and Pressure on Ultrasonic Bonding Strength of Flexible Printed Circuit Board to Glass with Nonconductive Film (2009)
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