Search Results1-16 of  16

  • Lee Jong-Bum ID: 9000024977442

    Articles in CiNii:1

    • Effect of surface treatment on the mechanical strength of ultrasonically bonded chip on copper-coated glass for ultra-fine pitch application in microelectronics (Special issue: Ultrasonic electronics) (2009)
  • Lee Jong-Bum ID: 9000024977631

    Articles in CiNii:1

    • Effect of time and pressure on ultrasonic bonding strength of flexible printed circuit board to glass with nonconductive film (Special issue: Ultrasonic electronics) (2009)
  • LEE Jong Bum ID: 9000001981465

    Department of Mathematics Sogang University (2007 from CiNii)

    Articles in CiNii:1

    • Homotopy minimal periods for expanding maps on infra-nilmanifolds (2007)
  • LEE Jong-Bum ID: 9000005123364

    Psychiatry, College of Medicine, Yeungnam University (2004 from CiNii)

    Articles in CiNii:1

    • Potentiated Modulation of Pregnolone on GABA _A Receptors in Behaviorally Stressed Borderline-Hypertensive Rats (2004)
  • LEE Jong-bum ID: 9000000016293

    Wonkwang University, Korea (1996 from CiNii)

    Articles in CiNii:1

    • Neural Network-based Fault Identification System for Underground Cable (1996)
  • Lee Jong Bum ID: 9000017291491

    School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ. (2009 from CiNii)

    Articles in CiNii:1

    • 2P4-3 Evaluation of high ductile ENIG plated electrodes bonded with transverse ultrasonic(Poster Session) (2009)
  • Lee Jong-Bum ID: 9000014632713

    School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ. (2010 from CiNii)

    Articles in CiNii:7

    • 2-09-03 Effect of Atmospheric Pressure Plasma Treatment on Joint Strength between Flip Chip Bump and Flexible Printed Circuit Board (FPCB) Bonded Using Ultrasonic(High power ultrasound) (2007)
    • 2-09P-48 Effect of Bonding Condition on Joint Strength between Rigid and Flexible Printed Circuit Boards(Poster session 2) (2007)
    • 1P1-11 Effect of atmospheric pressure plasma treatment on ultrasonic bumpless flip chip bonding(Poster Session) (2008)
  • Lee Jong-Bum ID: 9000018816878

    Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng. (2011 from CiNii)

    Articles in CiNii:1

    • 2Pb4-1 Reliability of Cu-Cu direct interconnections using ultrasonic bonding process between RPCB and FPCB(Poster Session) (2011)
  • Lee Jong-Bum ID: 9000025084896

    Articles in CiNii:1

    • Longitudinal ultrasonic bonding of electrodes between rigid and flexible printed circuit boards (Special issue: Ultrasonic electronics) (2008)
  • Lee Jong-Bum ID: 9000025085298

    Articles in CiNii:1

    • Effect of atmospheric pressure plasma treatment on transverse ultrasonic bonding of gold flip-chip bump on glass substrate (Special issue: Ultrasonic electronics) (2008)
  • Lee Jong-Bum ID: 9000391539804

    Wonkwang University (1994 from CiNii)

    Articles in CiNii:1

    • A Daily Operation Scheduling of Cogeneration System with a Thermal Storage Tank (1994)
  • Lee Jong-Bum ID: 9000391544866

    Wonkwang University (1996 from CiNii)

    Articles in CiNii:1

    • Neural Network-based Fault Identification System for Underground Cable (1996)
  • Lee Jong-Bum ID: 9000401781057

    Articles in CiNii:1

    • Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics (2009)
  • Lee Jong-Bum ID: 9000401781065

    Articles in CiNii:1

    • Effect of Time and Pressure on Ultrasonic Bonding Strength of Flexible Printed Circuit Board to Glass with Nonconductive Film (2009)
  • Lee Jong-bum ID: 9000253030678

    Korea Kumho Petrochemical Co., Ltd. Electronic Materials Division (2002 from CiNii)

    Articles in CiNii:1

    • New ArF Photoresist Based on Modified Maleic Anhydride Cycloolefin Polymers. (2002)
  • Lee Jong Bum ID: 9000242447158

    Articles in CiNii:1

    • TOPOLOGY OF ITERATED S^1-BUNDLES (2013)
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