Search Results1-20 of  52

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  • MORITA Toshiaki ID: 9000001158867

    Department of Materials Science and Engineering, Kyoto University (2005 from CiNii)

    Articles in CiNii:5

    • Friction and Elongation of Al Electrodes due to Micro-Sliding between the Inner Mo Electrode and the Al Electrodes in High-Power Devices (2002)
    • Micromechanics Model Concerning Yield Behavior of Nanocrystalline Materials (2004)
    • Effect of Difference in Young's Moduli between Surface-Layer and Substrate on Fatigue Strength (2004)
  • MORITA Toshiaki ID: 9000002117803

    Materials Research Laboratory, Hitachi Ltd. (2009 from CiNii)

    Articles in CiNii:3

    • Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior (2008)
    • Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles (2008)
    • Direct Bonding to Aluminum with Silver-Oxide Microparticles (2009)
  • MORITA Toshiaki ID: 9000003771754

    シャープ(株)情報技術研究所 (1996 from CiNii)

    Articles in CiNii:4

    • Human Interface for Personal Information Systems : On-Line Handwriting Recognition (1996)
    • An Online Recognition System for Handwriting (1996)
    • An OCR system for business cards (1993)
  • MORITA Toshiaki ID: 9000004509682

    Development of Applied Chemistry, Graduated School of Engineering, Tokyo Metropolitan University (2002 from CiNii)

    Articles in CiNii:2

    • Study of atomic emission spectrometric detector using a low frequency plasma for GC (2000)
    • Identification of halogens and estimation of elemental ratios with an atomic emission detectors using a radio frequency helium plasma for GC (2002)
  • MORITA Toshiaki ID: 9000005066318

    (株)日立製作所 日立研究所 (2011 from CiNii)

    Articles in CiNii:13

    • Vibration Analysis of Encapsulation for High Power Semiconductor Devices (2000)
    • Development of Lead Free Bonding Technique Corresponding to High Temperature Environment Using Micro-scaled Silver-oxide Particles (2010)
    • Evaluation of Particle Size and Pressure on Bondability of Joining Using Silver Nanoparticles (2010)
  • MORITA Toshiaki ID: 9000005601769

    Hitachi Research Laboratory, Hitachi Ltd. (1999 from CiNii)

    Articles in CiNii:1

    • Investigation of Low Loss and High Reliability Encapsulation Technology in Large-Area, High-Power Semiconductor Devices (1999)
  • MORITA Toshiaki ID: 9000006329869

    Sapporo School of the Arts (2005 from CiNii)

    Articles in CiNii:1

    • 2311 A case study on designing esthetically and making prototypes for IT appliances : Challenge of Sapporo IT Carrozzeria Project (2005)
  • MORITA Toshiaki ID: 9000018526928

    Hitachi, LTD. (2010 from CiNii)

    Articles in CiNii:1

    • Development of lead free bonding materials for high temperature environment (2010)
  • MORITA Toshiaki ID: 9000253145166

    Faculty of Agriculture, Nagoya University (1974 from CiNii)

    Articles in CiNii:1

    • Isosclerone, a New Metabolite of <i>Sclerotinia sclerotiorum</i> (LIB.) DE BARY (1974)
  • MORITA Toshiaki ID: 9000255704944

    Faculty of Engineering, Osaka University (1975 from CiNii)

    Articles in CiNii:1

    • Acid Catalyzed Reactions of 3-Phenoxypropylene Diacetate and 3-Phenoxypropyl Acetate with Formaldehyde (1975)
  • MORITA Toshiaki ID: 9000257962665

    Hitachi Research Laboratory, Hitachi Ltd. (2013 from CiNii)

    Articles in CiNii:1

    • Fabrication of transparent self-supporting alumina films by homogeneous precipitation process (2013)
  • MORITA Toshiaki ID: 9000261044481

    Hitachi Research Laboratory, Hitachi, Ltd. (2013 from CiNii)

    Articles in CiNii:1

    • Low-Temperature Bonding of Silver Derived from Silver-Oxide Particles to Nickel (2013)
  • MORITA Toshiaki ID: 9000261665230

    Hitachi Research Laboratory, Hitachi Ltd. (2013 from CiNii)

    Articles in CiNii:1

    • Development of Bonding Technique Using Silver Oxide Particles for High Temperature Environment (2013)
  • MORITA Toshiaki ID: 9000283836923

    Department of Applied Chemistry, Graduate School of Engineering, Tokyo Metropolitan University (2002 from CiNii)

    Articles in CiNii:1

    • Development of an Atomic Emission Spectrometric Detector for Gas Chromatography Using Radio Frequency Helium Plasma (2002)
  • Morita Toshiaki ID: 9000025059408

    Articles in CiNii:1

    • New method for estimating impact strength of solder-ball-bonded interfaces in semiconductor packages (2008)
  • Morita Toshiaki ID: 9000025059531

    Articles in CiNii:1

    • Study of bonding technology using silver nanoparticles (2008)
  • Morita Toshiaki ID: 9000025069742

    Articles in CiNii:1

    • Low-Temperature Bonding of Silver to Aluminum (2012)
  • Morita Toshiaki ID: 9000025126071

    Articles in CiNii:1

    • Low-temperature bonding using silver nanoparticles stabilized by short-chain alkylamines (2009)
  • Morita Toshiaki ID: 9000253248890

    Department of Materials Science and Technology, Graduate School of Engineering Sciences, Kyushu University (1993 from CiNii)

    Articles in CiNii:1

    • Bondability of Gold Wire to Gold-Plated Electrodes (1993)
  • Morita Toshiaki ID: 9000257816207

    Materials Research Laboratory, Hitachi Ltd. (2013 from CiNii)

    Articles in CiNii:1

    • Selection of Particle Size and Solvent to Lower the Pressure Required for Metal-to-Metal Bonding using Silver Nanoparticle Pastes (2013)
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