Search Results1-20 of  42

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  • Matsushima Michiya ID: 9000404148906

    Articles in CiNii:1

    • Electrical Property Improvement of Copper Filler Conductive Adhesive with Low-Melting Point Metal Bridge (2019)
  • Matsushima Michiya ID: 9000402375593

    Articles in CiNii:1

    • Characteristics and Microstructural Development of Cold-Sprayed Copper Coating on Aluminum (2019)
  • Matsushima Michiya ID: 9000402926772

    Articles in CiNii:1

    • Development of Polyester-Modified Epoxy Resins for Self-Organization Soldering (Special Issue on Frontier Researches Related to Interconnection, Packaging and Microjoining Materials and Microprocessing for Such Materials(Part 2)) (2019)
  • MATSUSHIMA MICHIYA ID: 9000258585011

    Graduate school of engineering, Osaka Univ. (2010 from CiNii)

    Articles in CiNii:1

    • Improvement of low temperature bondability of copper using multilayer film (2010)
  • MATSUSHIMA MICHIYA ID: 9000347220402

    Graduate School of Engineering, Osaka University (2015 from CiNii)

    Articles in CiNii:1

    • Effect of contact resistance on resistance micro-welding between Inconel and Pt alloys (2015)
  • MATSUSHIMA Michiya ID: 9000000746992

    Graduate Schllo of Engineering Science, Osaka University (2003 from CiNii)

    Articles in CiNii:2

    • A Change of Difficulty on"Wall-Bouncing"Taskt (2002)
    • Realization of the Table Tennis Task based on Virtual Targets (2003)
  • MATSUSHIMA Michiya ID: 9000002170259

    Osaka Univ. Dept. of Materials and Manufacturing Science, Graduate School of Eng. (2005 from CiNii)

    Articles in CiNii:1

    • Numerical Study of the Self-Interconnection Assembly Method Using Resin Containing Solder Fillers (2005)
  • MATSUSHIMA Michiya ID: 9000006027458

    Articles in CiNii:40

    • Experimental Verification of Lateral Flow Effects in Resin Containing Metallic Fillers on Self-organization Joining (2006)
    • Modeling of Three-Dimensional Optical Waveguide and Evaluation of the Light Propagation Loss for a Micro Stereo-Lithography in Resin (2006)
    • Effect of Chip Heating on Reliability Evaluation of BGA Solder Joints under Thermal Cycle Test (2006)
  • MATSUSHIMA Michiya ID: 9000254285164

    Osaka University (2002 from CiNii)

    Articles in CiNii:1

    • A Change of Difficulty on “Wall-Bouncing” Task (2002)
  • MATSUSHIMA Michiya ID: 9000258582363

    Division of Material and Manufacturing Science, Graduate School of Engineering, Osaka University (2018 from CiNii)

    Articles in CiNii:10

    • Study of deterioration of mechanical characteristics of solder joint under thermal circumstance (2008)
    • Improvement of Recognition Capability by Using Multi-Angle Image in Neuro Visual Inspection Systemu (2008)
    • Interfacial Reaction in Semiconductor Devices by Room Temperature Ultrasonic Soldering (2010)
  • MATSUSHIMA Michiya ID: 9000258742071

    Graduate School of Engineering, Osaka University (2013 from CiNii)

    Articles in CiNii:1

    • Report on 19th Symposium on "Microjoining and Assembly Technology in Electronics" (2013)
  • MATSUSHIMA Michiya ID: 9000261044636

    Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University (2013 from CiNii)

    Articles in CiNii:1

    • Surface Mounting Process Using Hybrid Resin Sheet Including Self-Organizable Solder Particles (2013)
  • MATSUSHIMA Michiya ID: 9000283875054

    Articles in CiNii:1

    • Experimental Verification of Lateral Flow Effects in Resin Containing Metallic Fillers on Self-organization Joining (2006)
  • MATSUSHIMA Michiya ID: 9000300217170

    Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University (2014 from CiNii)

    Articles in CiNii:1

    • Effects of Microstructural Changes of the Solder Joint Under Thermal Loading on the Life Under Vibrational Loading (2014)
  • MATSUSHIMA Michiya ID: 9000312252316

    Graduate School of Engineering, Osaka University (2014 from CiNii)

    Articles in CiNii:1

    • Report on 20<sup>th</sup> Symposium on "Microjoining and Assembly Technology in Electronics" (2014)
  • MATSUSHIMA Michiya ID: 9000312252376

    若手会員の会運営委員会委員 大阪大学 (2014 from CiNii)

    Articles in CiNii:1

    • WELNET for Young Members (2014)
  • MATSUSHIMA Michiya ID: 9000313613865

    Graduate School of Engineering, Osaka University (2015 from CiNii)

    Articles in CiNii:1

    • Report on 21st Symposium on "Microjoining and Assembly Technology in Electronics" (2015)
  • MATSUSHIMA Michiya ID: 9000345257605

    Graduate School of Engineering, Osaka University (2016 from CiNii)

    Articles in CiNii:1

    • Report on 22<sup>nd</sup> Symposium on "Microjoining and Assembly Technology in Electronics" (2016)
  • MATSUSHIMA Michiya ID: 9000361254310

    Osaka University (2017 from CiNii)

    Articles in CiNii:1

    • Report on 23<sup>rd</sup> Symposium on "Microjoining and Assembly Technology in Electronics" (2017)
  • MATSUSHIMA Michiya ID: 9000392047488

    Graduate school of Engineering, Osaka University (2017 from CiNii)

    Articles in CiNii:1

    • Thermal stress developed in Si/Cu bond using Sn filler metal (2017)
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