Search Results1-5 of  5

  • NAGAI Mizuki ID: 9000004969686

    EBARA Corporation (2010 from CiNii)

    Articles in CiNii:4

    • Cu Electroplating for Through Silicon Via (2008)
    • Two-step Copper Electroplating Technique using Seed Enhancement step (2001)
    • 21405 Electroplating for Cu through electrodes in 3D packaging (2008)
  • NAGAI Mizuki ID: 9000347545441

    Department of Gastroenterology, JA Toride Medical Center (2017 from CiNii)

    Articles in CiNii:1

    • A case of gastric syphilis with the initial manifestation of hematemesis (2017)
  • Nagai Mizuki ID: 9000258391988

    Ebara Corp. (2008 from CiNii)

    Articles in CiNii:1

    • Electroplating Technology for Through Silicon Via Copper Filling (2008)
  • Nagai Mizuki ID: 9000361241228

    Department of Gastroenterology, JA Toride Medical Center (2017 from CiNii)

    Articles in CiNii:1

    • A case of hemosuccus Pancreaticus (HP) , endoscopically diagnosed and successfully treated with transcatheter arterial embolization of a gastroduodenal artery aneurysm (2017)
  • Nagai Mizuki ID: 9000369348912

    Osaka City University (2017 from CiNii)

    Articles in CiNii:1

    • Formation Field and Geometry of Fissure Zone Emerged in the Aso-caldera in association with Kumamoto Earthquake (2017)
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