Search Results1-18 of  18

  • NISHI Kunihiko ID: 9000000107420

    Semiconductor & Integrated Circuits Div., Hitachi, Ltd. (1997 from CiNii)

    Articles in CiNii:1

    • Fatigue Life Evaluation of Solder Ball Joints (1997)
  • NISHI Kunihiko ID: 9000000627280

    Semiconductor & Integrated Circuits Assembly Technology Development Operation, Hitachi, Ltd. (2001 from CiNii)

    Articles in CiNii:1

    • Metal Finishing Technology for the Assembly of BGA and CSP (2001)
  • NISHI Kunihiko ID: 9000002843547

    MONOZUKURI Engineering Support Center, MONOZUKURI Engineering Division, Hitachi Ltd. (2007 from CiNii)

    Articles in CiNii:8

    • Intention to the Special Edition (2004)
    • Intention to the Special Edition (<Special Articles>Recent Jisso Technology for SiP and Its Future Trend) (2004)
    • Intention to the Special Edition(<Special Article>Packaging Technology for System in Package) (2001)
  • NISHI Kunihiko ID: 9000020094781

    Articles in CiNii:1

    • Development and application of the stress sensing test chip for IC plastic packages. (1987)
  • NISHI Kunihiko ID: 9000020496138

    Articles in CiNii:1

    • Thermal Stress in Silicon Chips Encapsulated in IC Plastic Packages under Temperature Cycling. (1991)
  • NISHI Kunihiko ID: 9000020498291

    Articles in CiNii:1

    • Residual stress in resin-molded IC chips. (1989)
  • NISHI Kunihiko ID: 9000020554341

    Articles in CiNii:1

    • Prediction of residual stress in LSI plastic packages by thermoviscoelastic analysis for a 3-layer laminated beam. (1990)
  • NISHI Kunihiko ID: 9000020574766

    Articles in CiNii:1

    • Thermal Stress in Silicon Chips Encapsulated in IC Plastic Packages. (1991)
  • NISHI Kunihiko ID: 9000020590922

    Articles in CiNii:1

    • A study of package cracking during the reflow soldering process. (1989)
  • NISHI Kunihiko ID: 9000107367093

    Articles in CiNii:1

    • An Abstract Data Type Database Management System as the Kernel of an Operating System (2010)
  • NISHI Kunihiko ID: 9000107367379

    Articles in CiNii:1

    • An Abstract Data Type Description Language (2010)
  • NISHI Kunihiko ID: 9000254664751

    Hitachi, Ltd. (1998 from CiNii)

    Articles in CiNii:1

    • Development of Coated-Wire Bonding Technology. (1998)
  • NISHI Kunihiko ID: 9000256072731

    Semiconductor & Integrated Circuits Div., Hitachi, Ltd. (1997 from CiNii)

    Articles in CiNii:1

    • Fatigue Life Evaluation of Solder Ball Joints. (1997)
  • NISHI Kunihiko ID: 9000256073020

    MONOZUKURI Engineering Support Center, MONOZUKURI Engineering Division, Hitachi Ltd. (2007 from CiNii)

    Articles in CiNii:1

    • Recent Activities in Semiconductor Packaging Technology:Introduction to This Special Article (2007)
  • NISHI Kunihiko ID: 9000256073590

    Assembly Technology Development Operation, Hitachi Ltd. (2001 from CiNii)

    Articles in CiNii:1

    • Intention to the Special Edition (2001)
  • NISHI Kunihiko ID: 9000256074297

    MONOZUKURI Engineering Division, Hitachi Ltd. (2004 from CiNii)

    Articles in CiNii:1

    • Intention to the Special Edition (2004)
  • NISHI Kunihiko ID: 9000256074629

    MONOZUKURI Engineering Division, Hitachi Ltd. (2005 from CiNii)

    Articles in CiNii:1

    • Intention to the Special Edition (2005)
  • Nishi Kunihiko ID: 9000255900061

    Musashi Works, Hitachi, Ltd. (1989 from CiNii)

    Articles in CiNii:1

    • Packaging process of ULSI. (1989)
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