Search Results1-20 of  32

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  • NISHIMURA Asao ID: 9000003015636

    Semiconductor and Integrated Circuits, Hitachi, Ltd. (2002 from CiNii)

    Articles in CiNii:3

    • 小型化と多ピン化が進むパッケ-ジ技術 (特集 システムソリュ-ションに寄与する半導体技術) (1998)
    • Development of Low-Cost and Highly Reliable Wafer Process Package "WPP-2" (2002)
    • Study of New Joining Process by YAG Laser with Cutting at One Pulse of Irradiation (1995)
  • NISHIMURA Asao ID: 9000003642751

    Articles in CiNii:5

    • Auめっきテープ基板を用いた超音波プリップチップ接合特性の検討 (2001)
    • Study of Fracture Mechanism and Effect of Particle Volume Fraction on Fracture Properties of Silica-Particulate-Filled Epoxy Resins (1998)
    • Influence of Au concentration on the formation of intermetallic compound layer at bond interface between Pb-Sn solder containing Au and Ni plating on Cu (1996)
  • NISHIMURA Asao ID: 9000003646441

    (株)日立製作所半導体グループ (2000 from CiNii)

    Articles in CiNii:7

    • Development of A System for Evaluating IC Plastic Package Damage Occurring During Reflow Soldering (1994)
    • Effect of Phosphorus-Doping on Crystallization-Induced Stress of Silicon Thin Films (1995)
    • Electronic Characteristic Changes of Semiconductor Devices Caused by Packaging Stress (1995)
  • NISHIMURA Asao ID: 9000006781016

    Jisso Partners, Inc. (2008 from CiNii)

    Articles in CiNii:1

    • Formation Mechanisms and Mitigation Methods of Internal Stress Type Whiskers (2008)
  • NISHIMURA Asao ID: 9000017064463

    Jisso Partners, Inc. (2012 from CiNii)

    Articles in CiNii:3

    • Formation & Suppression Mechanisms of Whiskers from the Same Sn-Cu Coating Electrodeposited on Two Different Cu Leadframes at Room Temperature (2010)
    • Whisker Mitigation Effects and Their Mechanisms of Sn-Based Alloy Finishes (2012)
    • Development of CAE System for Structural Design of LSI Packages (2003)
  • NISHIMURA Asao ID: 9000020039076

    Articles in CiNii:1

    • Effects of Filler Particle Shape and Size on Fracture Properties of Highly Silica Particulate-Filled Epoxy Resins. (1993)
  • NISHIMURA Asao ID: 9000020053517

    Articles in CiNii:1

    • Stress Intensity Factor for a Semi-Elliptical Crack in an Internally Pressurized Cylinder (1977)
  • NISHIMURA Asao ID: 9000020094760

    Articles in CiNii:1

    • Development and application of the stress sensing test chip for IC plastic packages. (1987)
  • NISHIMURA Asao ID: 9000020243785

    Articles in CiNii:1

    • Effect of Filler Particle-Size Distribution on Fracture Toughness of Silica Particulate-Filled Epoxy Resins. (1992)
  • NISHIMURA Asao ID: 9000020285779

    Articles in CiNii:1

    • Fracture Mechanics and Fractographic Analysis of Fatigue Crack Propagation Behavior in Wide Steel Plates (1974)
  • NISHIMURA Asao ID: 9000020496122

    Articles in CiNii:1

    • Thermal Stress in Silicon Chips Encapsulated in IC Plastic Packages under Temperature Cycling. (1991)
  • NISHIMURA Asao ID: 9000020498275

    Articles in CiNii:1

    • Residual stress in resin-molded IC chips. (1989)
  • NISHIMURA Asao ID: 9000020574760

    Articles in CiNii:1

    • Thermal Stress in Silicon Chips Encapsulated in IC Plastic Packages. (1991)
  • NISHIMURA Asao ID: 9000020589273

    Articles in CiNii:1

    • A Study of Package Cracking during the Reflow Soldering Process. 2nd Report. Strength Evaluation of the Plastic by Using Stress Singularity Theory. (1991)
  • NISHIMURA Asao ID: 9000020590283

    Articles in CiNii:1

    • Effect of package structure on the residual stress of silicon chips encapsulated in IC plastic packages. (1990)
  • NISHIMURA Asao ID: 9000020590919

    Articles in CiNii:1

    • A study of package cracking during the reflow soldering process. (1989)
  • NISHIMURA Asao ID: 9000021123361

    Articles in CiNii:1

    • Fracture properties of highly silica particulate filled epoxide resins. (1989)
  • NISHIMURA Asao ID: 9000021140856

    Articles in CiNii:1

    • A stress singularity parameter approach for evaluating reliability of LSI plastic package. (1990)
  • NISHIMURA Asao ID: 9000021177962

    Articles in CiNii:1

    • Fracture toughness measurement method and fracture properties of highly silica particulate filled epoxide resins. (1991)
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