Search Results1-7 of  7

  • NUKII Takashi ID: 9000002846051

    Articles in CiNii:9

    • マイクロエレクトロニクス実装技術の現状と動向 (2001)
    • 白物家電のブレークスルーに向けたプロローグ (特集 健康イオン家電) (2003)
    • 1. MES '99 開催にあたって(MES '99 報告, 第 9 回マイクロエレクトロニクスシンポジウム) (2000)
  • NUKII Takashi ID: 9000003015929

    Precision Technoloy Development Center, Production Technology Development Group, Sharp Corporation (1998 from CiNii)

    Articles in CiNii:5

    • Fine Pitch TAB/OLB Technology (1998)
    • The Rework Process Technology and Reliability Evaluation for CSP (1998)
    • A Flip-Chip Assembly Technology Suitable for Power Amplitire MMIC (1995)
  • NUKII Takashi ID: 9000255716238

    Production Technology Laboratories, Production Technology Development Group, Sharp Corp (1992 from CiNii)

    Articles in CiNii:1

    • Special Articles: Theme of Advanced Assembly and Packaging Technology. Subject Imposed on Hybrid Microelectronics Engineers. (1992)
  • NUKII Takashi ID: 9000255716450

    Precision Technology Development Center, Production Technology Development Group, Sharp Corporation (1998 from CiNii)

    Articles in CiNii:1

    • The Rework Process Technology and Reliability Evaluation for CSP. (1998)
  • NUKII Takashi ID: 9000256072099

    Production Technology Laboratories, Production Technology Development Group, Sharp Corporation (1993 from CiNii)

    Articles in CiNii:1

    • Flip-Chip Bonding on PWB. (1993)
  • Nukii Takashi ID: 9000254439462

    SHARP CORPORATION (1992 from CiNii)

    Articles in CiNii:1

    • Bare-Chip Face-down Bonding Technology Using Conductive Particles and Light-Setting Adhesives: "Elastic" Method. (1992)
  • Nukii Takashi ID: 9000398138978

    Leading Graduate School of Design, Center for Educational Program Promotion in Graduate School, Kyoto University (2018 from CiNii)

    Articles in CiNii:1

    • Establishment of the Kansai Branch of JIEP: A Short Retrospective (2018)
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